background image

Temperature

Compensating Type

High Dielectric Type

Pre-and Post-Stress 

Electrical Test

2 High Temperature 

The measured and observed characteristics should satisfy the

Set the capacitor for 1000±12 hours at 150±3

. Set for

Exposure (Storage)

specifications in the following table.

24±2 hours at room temperature, then measure.

Appearance

No marking defects

Capacitance

Within ±2.5% or ±0.25pF

R7/L8/R9: Within ±10.0%

Change

(Whichever is larger)

Q/D.F.

30pFmin. : Q

1000

R7/L8  W.V.: 25Vmin.: 0.03 max.

30pFmax.: Q 

400+20C

         W.V.: 16V/10V : 0.05 max.

C: Nominal Capacitance(pF)

R9 : 0.075max.

I.R.

More than 10,000M

Ω  or 500Ω

F

(Whichever is smaller)

R9 : More than 150Ω 

F

3 Temperature Cycling

The measured and observed characteristics should satisfy the

Fix the capacitor to the supporting jig in the same manner and under

specifications in the following table.

the same conditions as (19). Perform cycle test according to the four

Appearance

No marking defects

heat treatments listed in the following table. Set for 24±2 hours at 

Capacitance

Within ±2.5% or ±0.25pF

R7/L8/R9: Within ±10.0%

room temperature, then measure

Change

(Whichever is larger)

Q/D.F.

30pFmin. : Q

1000

R7/L8  W.V.: 25Vmin.: 0.03 max. 

30pFmax.: Q 

400+20C

          W.V.: 16V/10V : 0.05 max.

C: Nominal Capacitance(pF)

R9 : 0.05max.

I.R.

More than 10,000M

Ω  or 500Ω

F

(Whichever is smaller)

 Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10 

 for one hour and then set

for 24±2 hours at room temperature.

Perform the initial measurement.

4 Destructive 

No defects or abnormalities

Per EIA-469.

Phisical Analysis

5 Moisture Resistance

The measured and observed characteristics should satisfy the

Apply the 24-hour heat (25 to 65

) and humidity (80 to 98%)

specifications in the following table.

treatment shown below, 10 consecutive times.

Appearance

No marking defects

Set for 24

±

2 hours at room temperature, then measure.

Capacitance

Within ±3.0% or ±0.30pF

R7/L8/R9: Within ±12.5%

Change

(Whichever is larger)

Q/D.F.

30pFmin. : Q

350

R7/L8 : W.V.: 25Vmin.: 0.03 max.

10pF and over, 30pF and below:

          W.V.: 16V/10V : 0.05 max.

Q

275+5C/2

R9 : 0.075max.

10pFmax.: Q 

200+10C

C: Nominal Capacitance(pF)

I.R.

More than 10,000M

Ω  or 500Ω

F

(Whichever is smaller)

R9 : More than 150

Ω

F

6 Biased Humidity 

The measured and observed characteristics should satisfy the

Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)

specifications in the following table.

at 85±3

 and 80 to 85% humidity for 1000±12 hours.

Appearance

No marking defects

Remove and set for 24±2 hours at room temprature, then measure.

Capacitance

Within ±3.0% or ±0.30pF

R7/L8/R9: Within ±12.5%

The charge/discharge current is less than 50mA.

Change

(Whichever is larger)

Q/D.F.

30pF and over: Q

200

R7/L8  W.V.: 25Vmin.: 0.035 max.

30pF and below: Q

100+10C/3

          W.V.: 16V/10V : 0.05 max.

C: Nominal Capacitance(pF)

R9 : 0.075max.

I.R.

More than 1,000M

Ω  or 50Ω

F

(Whichever is smaller)

AEC-Q200 Murata Standard Specification and Test Methods

No

AEC-Q200 Test Item

AEC-Q200 Test Method

Specification.

1

-

Step 

Time(min) 

Cycles 

1000(for ΔC/R7) 

300(for 5G/L8/R9) 

15±3 

-55℃+0/-3 

-55℃+0/-3 

Room 

Room 

15±3 

125℃+3/-0 

150℃+3/-0 

Room 

Room 

 

 

One cycle 24hours 

Hours 

Initial measuremt 

+10 
- 2 ℃ 

Humidity 
90~98% 

Humidity 
80~98% 

Humidity 
80~98% 

Humidity 
90~98% 

Humidity 
90~98% 

0  1  2  3  4  5  6  7  8  9  10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 

Temperature  

70 
65 
60 
55 
50 
45 
40 
35 
30 
25 
20 
15 
10 
 5 
 0 
-5 
-10 

(℃) 

JEMCGS-0363S

2

Summary of Contents for GCM1885C1H390FA16D 0603

Page 1: ...1 55 to 125 C 0 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 C...

Page 2: ...sistance The measured and observed characteristics should satisfy the Apply the 24 hour heat 25 to 65 and humidity 80 to 98 specifications in the following table treatment shown below 10 consecutive t...

Page 3: ...perpendicular axes of the test specimen 18 shocks Change The specified test pulse should be Half sine and should have a Q D F 30pFmin Q 1000 R7 L8 W V 25Vmin 0 025 max duration 0 5ms peak value 1500g...

Page 4: ...nd rosin JIS K 5902 25 rosin in weight propotion Immerse in eutectic solder solution for 5 0 0 5 seconds at 235 5 c should be placed into steam aging for 8 hours 15 minutes After preheating immerse th...

Page 5: ...5max uniform and gree of defects such as heat shock C Nominal Capacitance pF R9 0 05max I R More than 10 000M or 500 F Whichever is smaller in mm 20 Beam Load Test Destruction value should be exceed f...

Page 6: ...Temperature Within the specified tolerance 1 3 and 5 by the cap value in step 3 Coefficent Table A Capacitance Within 0 2 or 0 05 pF Drift Whichever is larger 2 High Dielectric Constant Type The rang...

Page 7: ...10000 M 3000 10000 N 2000 8000 R D E 1000 4000 M 1000 5000 N R 1000 4000 E 500 2000 M 1000 5000 N R 1000 4000 1 2 Dimensions of Tape 1 GC 03 15 W8P2 CODE D E J F in mm Code GC 03 GC 15 A 3 0 37 0 65...

Page 8: ...3 5 0 2 5 GC 43 55 in mm Code GC 43 GC 55 A 2 3 6 5 2 2 Nominal value B 2 4 9 6 1 Package GC Type 4 0 0 1 4 0 0 1 2 0 0 1 1 5 0 1 0 1 75 0 1 8 0 0 3 3 5 0 05 1 1 max 8 0 0 3 4 0 0 1 3 5 0 05 1 75 0 1...

Page 9: ...ip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence W w1 GC 32 max 16 5 max 10 1 5 GC 43 55 20 5 max 14 1 5 180 0 3 0 330 2 0 50 min 13 0 5 2 0...

Page 10: ...9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is...

Page 11: ...he following conditions Temperature of 5 to 40 and a Relative Humidity of 20 to 70 1 Sunlight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during...

Page 12: ...itors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperat...

Page 13: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 14: ...such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high die...

Page 15: ...re piled up or handled the corners of another printed circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mount...

Page 16: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 17: ...tions Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumula...

Page 18: ...e to maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to chips not listed in Table 2 Table 2 In case of repea...

Page 19: ...n 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GC 03 15 18 the top of the solder fillet should be lower tha...

Page 20: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 21: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Page 22: ...t can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugge...

Page 23: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 24: ...and dimensions into consideration to eliminate the possibility of excess solder fillet height 1 2 It is possible for the chip to crack by the expansion and shrinkage of a metal board Please contact u...

Page 25: ...w Soldering Method Dimensions Part Number GC 31 3 2 1 6 2 2 2 6 1 0 1 1 1 0 1 4 in mm Table 2 Reflow Soldering Method Dimensions Part Number GC 31 3 2 1 6 2 2 2 4 0 8 0 9 1 0 1 4 GC 32 3 2 2 5 2 0 2 4...

Page 26: ...rol curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of So...

Page 27: ...n under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance...

Page 28: ...n 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your tec...

Page 29: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Murata GCM1885C1H390FA16J GCM1885C1H390FA16D...

Reviews: