Appendix B – Compliance Statements
Multi-Tech Systems, Inc. MMCModem GPRS Developer’s Guide (S000445D)
38
Restriction of the Use of Hazardous Substances
(RoHS)
Multi-Tech Systems, Inc.
Certificate of Compliance
2002/95/EC
Multi-Tech Systems Inc. confirms that MTxxxxSMI, MTSMC-G-F4, MTxxxxSEM, MTIFM, and
MTxxxSWM now comply with the chemical concentration limitations set forth in the directive
2002/95/EC
of the European Parliament (Restriction Of the use of certain Hazardous Substances
in electrical and electronic equipment -
RoHS
)
These Multi-Tech Systems, Inc. products do not contain the following banned chemicals:
Lead, [Pb] > 1000 PPM
Mercury, [Hg] > 1000 PPM
Hexavalent Chromium, [Cr+6] > 1000 PPM
Cadmium, [Cd] > 100 PPM
Polybrominated Biphenyl, [PBB] > 1000 PPM
Polybrominated Diphenyl Ether, [PBDE] > 1000 PPM
Moisture Sensitivity Level (MSL) =1
Tin Whisker Growth = None detected
Maximum Soldering temperature = 260C (wave only)
Notes:
1.
Lead usage in some components is exempted by the following RoHS annex; therefore, higher lead
concentration would be found in some modules (>1000ppm).
a. Lead in high melting temperature type solders (i.e., tin-lead solder alloys containing more
than 85% lead).
b. Lead in electronic ceramic parts (e.g., piezoelectronic devices).
2.
Moisture Sensitivity Level (MSL) – Analysis is based on the components/material used on the
board.
3.
Tin Whisker Study was done per NEMI guidelines (Elevated temperature cycle of 60°C and non-
condensing relative humidity of 87% exposed to this environment for 1000 hours).
