9-2
MPC180E Security Processor User’s Manual
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Package Thermal Characteristics
9.2 Package Thermal Characteristics
Table 9-2 shows the thermal resistances for the 100 pin LQFP package.
9.3 Pin Capacitance
Table 9-3 shows the pin capacitances for the input and I/O pins.
Table 9-2. Package Thermal Characteristics
Rating
Symbol
Max
Unit
Junction to ambient
1,2
(@200Ifm)
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, board population, and board thermal resistance.
2
Per SEMI G38-87.
Single–layer board
Four–layer board
R
40
25
°
C/W
Junction to board
3
(bottom)
3
Indicates the average thermal resistance between the die and the printed circuit board.
R
17
°
C/W
Junction to case
4
(top)
4
Indicates the average thermal resistance between the die and the case top surface via the cold plate
method (MIL SPEC-883 Method 1012.1).
R
9
°
C/W
Table 9-3. Capacitance
1
1
f = 1.0MHz, TA = 0 to 70
∞
C, periodically sampled rather than 100% tested
Parameter
Symbol
Min
Typ
Max
Unit
Input capacitance
C
in
—
5
7
pF
Input/output capacitance
C
I/O
—
5
7
pF
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Freescale Semiconductor, Inc.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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