
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Application note
APT0501
December 2011
www.microsemi.com
fig 4: SP4 base plate with properly applied thermal grease after removal from heat sink.
3.
Hole diameters in the PCB.
3.1
Top view.
Fig 5: pad and hole diameters (in millimeters).
SP4 pinout can change according to the configuration (full bridge, boost chopper…). Each module
datasheet has specific hole location information.
Hole
∅
2.9
±0.1
(4x)
hole
∅
1.5
±0.1
pad
∅
2.8
±0.1
Hole
∅
12.7
±0.1
(2x)
Heat sink
PCB