Specifications 129
_______________________________________________________________________________________________
_______________________________________________________________________________________________
MICROPLEX
Operator’s Manual SOLID T11 DT / TT
Edition 1.1
11. Specifications
Print technology:
Print speed:
Resolution:
Media width:
max. Print width:
Media thickness:
Interfaces:
Dimensions:
Width
(W):
Depth
(D):
Height
(H):
Weight:
Environment:
Mains connection:
Power input:
SOLID T11 TD
SOLID T11 TT
non-impact direct thermal printing thermal transfer printing
and direct thermal printing
2 up to 6 Inch/second (50 up to 150 mm/second)
300 dpi (dots per inch, horizontal and vertical)
up to 11.8 Inch (300 mm), minimum width 5.16 Inch (131 mm)
10.5 Inch (266 mm)
up to 0.008 inches (0.21 mm)
parallel: IEEE 1284 (Centronics), (MP-BUS, SPS-Control, optional)
serial: USB 1.1
LAN: Ethernet 10/100 Mbit (TCP-IP)
Optional:
LAN: Ethernet (SPX-IPX, LAT), Token Ring
Host: IBM SCS / IPDS (Twinax/Coax), Siemens (BAM/SS-97)
18.7 inches (475 mm)
12.3 inches (314 mm)
10.8
inches
(275 mm) 12.6 inches (320 mm)
appr. 22 kg appr. 23 kg
temperature: +5°C to +40°C (operating)
- 5°C to +60°C (storage temperature)
relative atmospheric humidity: 30 to 80 % (without condensation)
100 - 240 V AC, 50/60 Hz
appr. 0.56 kVA (operating)
