2011-2015 Microchip Technology Inc.
DS40001609E-page 309
PIC16(L)F1508/9
29.0
ELECTRICAL SPECIFICATIONS
29.1
Absolute Maximum Ratings
(†)
Ambient temperature under bias...................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to V
SS
on V
DD
pin
PIC16F1508/9 ........................................................................................................... -0.3V to +6.5V
PIC16LF1508/9 ......................................................................................................... -0.3V to +4.0V
on MCLR pin ........................................................................................................................... -0.3V to +9.0V
on all other pins ............................................................................................................ -0.3V to (V
DD
+ 0.3V)
Maximum current
on V
SS
pin
(1)
-40°C
T
A
+85°C .............................................................................................................. 250 mA
+85°C
T
A
+125°C ............................................................................................................. 85 mA
on V
DD
pin
(1)
-40°C
T
A
+85°C .............................................................................................................. 250 mA
+85°C
T
A
+125°C ............................................................................................................. 85 mA
Sunk by any standard I/O pin ............................................................................................................... 50 mA
Sourced by any standard I/O pin .......................................................................................................... 50 mA
Clamp current, I
K
(V
PIN
< 0 or V
PIN
> V
DD
) ...................................................................................................
20 mA
Total power dissipation
(2)
............................................................................................................................... 800 mW
Note 1:
Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations, see
to calculate device
specifications.
2:
Power dissipation is calculated as follows: P
DIS
= V
DD
x {I
DD
–
I
OH
} +
{(V
DD
– V
OH
) x I
OH
} +
(V
O
l x I
OL
).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
