Microchip Technology MRF24WN0MA, Manual

Page: 10 / 37

MRF24WN0MA/MB
DS50002410A-page 10
Advance Information
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2015 Microchip Technology Inc.
FIGURE 1-7: MRF24WN0MA/MB HOST PCB EXAMPLE LAYOUT
1.3 Soldering Recommendations
The MRF24WN0MA/MB wireless module was assem-
bled using the IPC/JEDEC J-STD-020 Standard lead-
free reflow profile. The MRF24WN0MA/MB module
can be soldered to the host PCB using standard leaded
and lead-free solder reflow profiles.
To avoid damaging the module, adhere to the following
recommendations:
• Solder reflow recommendations are provided in
the Microchip Application Note, AN233 "Solder
Reflow Recommendation" (DS00233)
• Do not exceed a peak temperature (T
P
) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations from the vendor
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
Best
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