Microchip Technology MCP6 series, User Manual

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Installation and Operation
©
2007 Microchip Technology Inc. DS51673A-page 21
2.4.3 Amplifier Modifications Using 8-Pin SOIC Op Amps
There are two options available to use single op amps in SOIC-8 packages (150 mil
wide):
• Soldering onto the MCP6XXX Amplifier Evaluation Board 3, or
• Soldering it onto a separate board which is connected to the DIP-8 socket
Figure 2-18 shows a SOIC-8 op amp soldered onto the MCP6XXX Amplifier Evaluation
Board 3.
FIGURE 2-18: Op Amp in SOIC-8 package soldered onto MCP6XXX Amplifier
Evaluation Board 3.
Figure 2-19 shows a SOIC-8 op amp and a DIP-8 socket, soldered onto the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board available from Microchip Technology Inc.
(order # SOIC8EV). The two interconnect strips on the bottom are Samtec part #
BBS-14-T-B or equivalent and are soldered into the through holes for the DIP-8 socket.
Figure 2-20 shows this board plugged into the MCP6XXX Amplifier Evaluation Board
3.
Note: The DIP-8 socket must be empty; only one op amp can be used at a time.
Solder an SOIC-8
Op Amp onto the
board
The PDIP socket
must be empty
Note: Insert the interconnect strips into the DIP-8 socket on the MCP6XXX
Amplifier Evaluation Board 3. Place the SOIC8EV board on the top of the
interconnect strips with the same pin orientation. Now solder the strips to
the top board; this procedure ensures correct alignment of the strips. Clip
the pins flush with the top surface of the SOIC8EV board, then solder the
SOIC-8 op amp on the top.