B
o
ard
Layo
ut an
d Sch
e
matics
2018
Micr
ochip T
e
ch
nol
ogy
Inc.
DS
50002761A
-page 17
A.3
PCB LAYOUT
The dsPIC33EP128GS806 DP PIM is a four-layer FR4, 1.55 mm, Plated Through-Hole (PTH) PCB construction.
through
illustrate
the PCB layers and
shows the assembly drawings of the dsPIC33EP128GS806 DP PIM.
FIGURE A-3:
dsPIC33EP128GS806 DIGITAL POWER PIM TOP SILKSCREEN AND TOP COPPER
Top Silkscreen
Top Copper
