MeiG Smart product technical information
SLM500
Hardware Design Guide
Page 8
1.
Introduction
This document describes the hardware application interface of the module, including the
connection of the circuit and the RF interface. It can help users quickly understand the interface
definition, electrical performance, and structural dimensions of the module. Combining this
document with other application documents, users can quickly use modules to design mobile
communication applications.
2.
Module overview
SLM500 module uses the Qualcomm solution based on arm cotex-A53 four core processor,
with the highest main frequency of 4 * 1.3GHz, and the memory supports single channel 32-bit
LPDDR3/672MHz.This module is suitable for broadband intelligent wireless communication
modules of TD-LTE/FDD-LTE/WCDMA/EVDO/TD-SCDMA/CDMA/GSM network
standards.
The physical interface of the module is a 272-pin pad that provides the following hardware
interfaces:
Three 1.8V UART serial ports, supporting four or two wires.
Main LCD
（
MIPI interface
）
.
Two groups of Camera interface
（
MIPI data
）
.
USB2.0 interface.
Three groups of Audio input interface.
Three groups of Audio output interface.
Dual-Sim card interface.
GPIO interface.
Five groups of I2C interfaces.
One sets of SPI interfaces.
TF card interface.
Support GNSS
，
WiFi
，
Bluetooth 4.2
