Reference Design HFRD-34.0 (Rev.3, 05/08)
Maxim Integrated Products
Page 16 of
18
compatibility of the reference design with
a wider variety of DVI video cards.
11 Evaluation/Use Notes
This reference design aids designers and is not
intended to replace the entire design process. The
designer should evaluate the reference design and
modify it, as necessary, to meet the specification
for a particular project. The designer should also
carefully consider safety and EMI issues related to
the specific application.
Maxim cannot assume responsibility for use of
any circuitry other than circuitry entirely
embodied in a Maxim product. No circuit patent
licenses are implied. Maxim reserves the right to
change the circuitry and specifications without
notice at any time.
12 Layer Profile
The HFRD-34.0 DVI KVM switch includes
controlled-impedance transmission lines. The
layer profile is based on the following
assumptions:
1.
Dielectric material is FR-4 with a
dielectric constant of ~ 4.2.
2.
0.5oz copper foil before platting.
3.
For USB signal-transmission lines: 10mil
W, 8mil S -> 90
Ω
Ω
Ω
Ω
Differential
4.
For DVI signal-transmission lines: 8mil
W, 8mil S -> 100
Ω
Ω
Ω
Ω
Differential
Table 2. HFRD-34.0 Layer Profile
Layer
Dielectric
Thickness
(inches)
Copper
Clad
Layer
Desc.
1
0.5
SIGNAL
0.0081
2
0.5
PLANE
0.005
3
0.5
SIGNAL
0.0036
4
0.5
SIGNAL
0.005
5
0.5
PLANE
0.0088
6
0.5
SIGNAL
0.005
7
0.5
PLANE
0.0036
8
0.5
SIGNAL
0.005
9
0.5
PLANE
0.0081
10
0.5
SIGNAL
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim
product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and
specifications without notice at any time.