Ref. No.
Procedure Shown in Fig —.
To remove —.
Remove —.
1
1
1
Lower Cabinet
Screws (2.6×12) . . . . . . . . . . . . . (
2
1 ~ 2
2
Printed Circuit Board
Remove the P.C.Board
7. HOW TO REPLACE FLAT PACKAGE IC
7.1. Preparation
- SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
- Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 ~ 80 W iron, but beginner might
damage foil by overheating.)
- Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
7.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2
pins.
*Most important matter is accurate setting of IC to the
corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
16
Summary of Contents for KM40108849C3
Page 3: ...1 LOCATION OF CONTROLS 2 DISPLAY 3...
Page 15: ...6 DISASSEMBLY INSTRUCTIONS 15...
Page 18: ...8 2 Speakerphone IC Data 18...
Page 21: ...10 BLOCK DIAGRAM 11 BLOCK DIAGRAM IC 1 21...
Page 22: ...11 1 Communication ICs 12 MODULE BLOCK DIAGRAM 12 1 MODULE BLOCK DIAGRAM 22...
Page 28: ...28...
Page 30: ...14 4 No Ringing Sound When Ring Signal is Input 30...
Page 31: ...15 CABINET AND ELECTRICAL PARTS LOCATION 31...
Page 32: ...32...
Page 44: ...E C B E C B E C B E C B B C E B C E B C E IC601 IC903...