Marantz PS5400, Service Manual

Page: 27 / 80

43
S -801 Series
SOT-23-5
No. Test item Test Condition Test Time r/n
1 # High Temperature Bias
Ta=125
°
C V
DD
=Vabs max.
×
0.9
1000 h 0/22
2 # Temperature Humidity Bias
Ta=85
°
C RH=85 % V
DD
=Vabs max.
×
0.9
1000 h 0/22
3 # Un-saturated
Pressure Cooker Bias
Ta=125 ˚C RH=85 % P=2
×
10
5
Pa
V
DD
=Vabs max.
×
0.9
100 h 0/22
4 # High Temperature Storage Tstg max.=150
°
C 1000 h 0/22
5 # Low Temperature Storage Tstg min.=
−
65
°
C 1000 h 0/22
6 # Temperature Cycle
( Gas phase ) Tstg max.=150
°
C , Tstg min.=
−
65
°
C ( 30min each ) 200 cycles 0/22
7 # Thermal Shock
( Liquid phase ) Tstg max=150
°
C , Tstg min.=
−
65
°
C ( 5min each ) 100 cycles 0/22
8 Solderability T=230
°
C
±
5
°
C 5 s 0/11
9 Lead Strength
(Pull test)
Pull force ; 2.5 N 30 s 0/11
10 Lead Strength
(Bending test)
Load ; 1.25 N
45 degree Bend a lead Twice 0/11
11 ESD V=
±
2000 V C=100 pF R =1.5 k
Ω
Ref. To V
DD
/ V
SS
( 5 units for each direction )
5 pulses 0/20
12 Latch Up
±
100 mA ( V
CLAMP
= Vabs max. ) 10 ms pulse
V
DD
= Vopr max.
1 pulse 0/5
Remark : Vabs max. = Absolute maximum voltage , Vopr max. =Maximum operation voltage
#
: Each test designated # is performed after Pre-Treatment finished.
Pre-Treatment consists of High Temperature Storage ,Temperature Humidity
Storage and Soldering Heat. (See the table below.)
Pre Treatment
High Temp.
Storage
Temperature
Humidity Storage
Soldering Heat
Ta=125 ˚C
t=24 h
Ta=85 ˚C
RH=65 %
t=168 h
Solder Dipping
T=260
°
C
t=10 s
7. IC DATA
IC29 : S-80145