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ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-
face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen-
erate static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED “DAN-
GEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF
ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
Summary of Contents for LM-D2540A
Page 5: ... 1 6 ...
Page 16: ... BLOCK DIAGRAM 2 11 2 12 ...
Page 17: ...2 13 2 14 SCHEMATIC DIAGRAMS MAIN SCHEMATIC DIAGRAM ...
Page 18: ...2 15 2 16 MAIN AMP SUB POWER SCHEMATIC DIAGRAM ...
Page 19: ...2 17 2 18 MAIN DECK SCHEMATIC DIAGRAM ...
Page 20: ...2 19 2 20 FRONT SCHEMATIC DIAGRAM ...
Page 21: ...2 21 2 22 MIC SCHEMATIC DIAGRAM ...
Page 22: ...2 23 2 24 POWER A V JACK SCHEMATIC DIAGRAM ...
Page 23: ...2 25 2 26 POWER A V JACK SCHEMATIC DIAGRAM ...
Page 24: ...2 27 2 28 WIRING DIAGRAM ...
Page 25: ...2 29 2 30 PRINTED CIRCUIT DIAGRAMS MAIN P C BOARD SOLDER SIDE ...
Page 26: ...2 31 2 32 MAIN P C BOARD COMPONENT SIDE ...
Page 27: ...2 33 2 34 FRONT P C BOARD SOLDER SIDE ...
Page 28: ...2 35 2 36 FRONT P C BOARD COMPONENT SIDE ...
Page 29: ...2 37 2 38 POWER P C BOARD COMPONENT SIDE ...
Page 30: ...2 39 2 40 POWER P C BOARD SOLDER SIDE ...
Page 32: ...2 43 2 44 A V JACK P C BOARD SOLDER SIDE A V JACK P C BOARD COMPONENT SIDE ...
Page 33: ...2 45 2 46 ...
Page 34: ... 3 1 SECTION 3 DVD PART DVD ELECTRICAL TROUBLESHOOTING GUIDE 1 Power check flow ...
Page 35: ... 3 2 2 Test debug flow ...
Page 36: ... 3 3 ...
Page 37: ... 3 4 ...
Page 38: ... 3 5 ...
Page 39: ... 3 6 ...
Page 40: ... 3 7 INTERNAL BLOCK DIAGRAM of ICs ES6603 IC401 BLOCK DIAGRAM ...
Page 41: ... 3 8 ...
Page 42: ... 3 9 ...
Page 43: ... 3 10 ...
Page 44: ... 3 11 BA5954FM IC404 BLOCK DIAGRAM ...
Page 45: ... 3 12 ES6698 IC501 BLOCK DIAGRAM ...
Page 46: ... 3 13 ...
Page 47: ... 3 14 ...
Page 48: ... 3 15 ...
Page 49: ... 3 16 ...
Page 50: ... 3 17 ...
Page 51: ... 3 18 ...
Page 52: ... 3 19 ...
Page 53: ... 3 20 ...
Page 54: ... 3 21 ...
Page 55: ... 3 22 DVD BLOCK DIAGRAM ESS 3 CHANGER SYSTEM BLOCK DIAGRAM ...
Page 56: ... 3 23 ESS 3 CHANGER MEMORY HOST I F BLOCK DIAGRAM ...
Page 57: ... 3 24 ESS 3 CHANGER SERVO MOTOR BLOCK DIAGRAM ...
Page 58: ... 3 25 ESS 3 CHANGER A V SYSTEM BLOCK DIAGRAM ...
Page 60: ...3 27 3 28 SCHEMATIC DIAGRAMS MPEG SCHEMATIC DIAGRAM ...
Page 61: ...3 29 3 30 RF SERVO SCHEMATIC DIAGRAM ...
Page 62: ...3 31 3 32 I O SCHEMATIC DIAGRAM ...
Page 63: ...3 33 3 34 PRINTED CIRCUIT DIAGRAMS MAIN P C BOARD SOLDER SIDE ...
Page 64: ...3 35 3 36 MAIN P C BOARD COMPONENT SIDE ...
Page 69: ......
Page 71: ... 5 2 ...