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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.5.5 GSM PAM (U102:TQMTM5012)
The TQMTM5012 Power Amplifier Module (PAM) is designed in a compact form factor for quad-band
cellular handsets comprising GSM850/900, DCS1800, PCS1900, and supports Class 12 General
Packet Radio Service (GPRS) multi-slot operation.
The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block, impedance
matching circuitry for 50 ߟ input and output impedances, and a Power Amplifier Control (PAC) block.
A custom CMOS integrated circuit provides the internal PAC function and interface circuitry. Two
separate Hetero-junction Bipolar Transistor (HBT) PA blocks are fabricated onto InGaP/GaAs die; one
supports the GSM850/900 bands, the other supports the DCS1800 and PCS1900 bands. Both PA
blocks share common power supply pins to distribute current. The GaAs die, the silicon die, and the
passive components are mounted on a multi-layer laminate substrate and the entire assembly is
encapsulated with plastic overmold.
[Fig. 3.7] GSM PAM Schematic
C152
C152
4.7u
4.7u
39p
39p
C164
C164
C157
C157
1.5nH
1.5nH
6.8nH
6.8nH
L113
L113
1000p
1000p
C154
C154
C156
C156
15p
15p
15p
15p
C159
C159
2.2K
2.2K
R113
R113
NA
NA
L112
L112
C165
C165
DNI
DNI
DNI
DNI
C166
C166
100p
100p
C155
C155
100ohm
100ohm
R111
R111
GND1G
N
D
1
2
3
GND2G
N
D
2
GND3G
N
D
3
4
6
GND4G
N
D
4
GND5G
N
D
5
8
1
RFIN
RFIN
RFOUT
RFOUT
5
7
VC
VC
LMSM32AA-533
LMSM32AA-533
FL102
FL102
C160
C160
39p
39p
3
VBATT
VBATT
4
VRAMP
VRAMP
5
BAND_SELECT
BAND_SELECT
2
DCS_PCS_IN
DCS_PCS_IN
1
11
11
DCS_PCS_OUT
DCS_PCS_OUT
GND1
GND1
7
GND2
GND2
12
12
8
GSM_IN
GSM_IN
9
GSM_OUT
GSM_OUT
6
NC1
NC1
NC2
NC2
10
10
TX_EN
TX_EN
TQM7M5012
TQM7M5012
U102
U102
C153
C153
15p
15p
+VPWR
+VPWR
GSM_PA_EN
GSM_PA_EN
GSM_PA_BAND
GSM_PA_BAND
GSM_SAW_SW_MODE
GSM_SAW_SW_MODE
TX_DCS_PCS
TX_DCS_PCS
TX_GSM
TX_GSM
GSM_PA_RAMP
GSM_PA_RAMP
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