LG KE 770, Service Manual

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3. TECHNICAL BRIEF
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3.15.1. General Features
•
Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory
•
Fabricated in advanced low power 0.13µm CMOS technology
•
Very low component count (6 external components)
•
Ultra low power design
- Peak current 40mA for basic data rate
- Peak current 45mA for enhanced data rate
- Bluetooth low power mode typ. 25
µ
A
•
Multiple input clock signals supported (10-40MHz)
•
Supply from external voltage regulator 1.8V..3.6V 1)
•
Autonomous power down scenarios of Bluetooth and cellular system supported
•
Packages:
- P-VQFN-48 package
- P-WFLGA-56 package
•
Temperature range from -40
°
C up to 85
°
C
•
Boundary scan for interface lines via JTAG
3.15.2 Micro-Controller-Section
•
ARM7TDMI-STM ARM® Processor for protocol and application software
•
Wa Interrupt Module
3.15.3 Micro-Controller Memory
•
32 KByte RAM
•
256 KByte read only Program Memory
•
8 KByte Patch RAM
3.15.4 Interfaces
•
UART (Bluetooth - Interface, support for HCI UART and Three-Wire UART transport layers
with/without hardware handshaking) up to 3.25MBaud
•
Two channel PCM Audio interface with I2S mode
•
I2C Interface
•
Three channel full duplex CVSD trans coder
•
General Purpose I/Os
- External interrupt
- Port output levels available during low-power mode (VDD supplied)
•
Separate voltage domains for GPIO, UART and PCM interfaces
•
Control signal for requesting external (cellular) system clock
•
Multi frequency (e.g. 32.768 kHz) low power clock input