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SERVICING PRECAUTIONS
CAUTION: Before servicing the HD/SD PERSONAL VIDEO
RECORDER & RECEIVER WITH GEMSTAR covered by
this service data and its supplements and addends, read and
follow the SAFETY PRECAUTIONS. NOTE: if unforeseen
circumstances create conflict between the following servic-
ing precautions and any of the safety precautions in this pub-
lications, always follow the safety precautions.
Remember Safety First:
General Servicing Precautions
1. Always unplug the HD/SD PERSONAL
VIDEO
RECORDER & RECEIVER WITH GEMSTAR AC power
cord from the AC power source before:
(1) Removing or reinstalling any component, circuit board,
module, or any other assembly.
(2) Disconnecting or reconnecting any internal electrical
plug or other electrical connection.
(3) Connecting a test substitute in parallel with an elec-
trolytic capacitor.
Caution:
A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may result
in an explosion hazard.
2. Do not spray chemicals on or near this HD/SD PERSON-
AL VIDEO RECORDER & RECEIVER WITH GEMSTAR
or any of its assemblies.
3. Unless specified otherwise in this service data, clean
electrical contacts by applying an appropriate contact
cleaning solution to the contacts with a pipe cleaner,
cotton-tipped swab, or comparable soft applicator.
Unless specified otherwise in this service data, lubrication
of contacts is not required.
4. Do not defeat any plug/socket B+ voltage interlocks with
which instruments covered by this service manual might
be equipped.
5. Do not apply AC power to this HD/SD PERSONAL VIDEO
RECORDER & RECEIVER WITH GEMSTAR and / or any
of its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
6. Always connect the test instrument ground lead to an
appropriate ground before connecting the test instrument
positive lead. Always remove the test instrument ground
lead last.
Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn
the power on. Connect an insulation resistance meter (500V)
to the blades of the attachment plug. The insulation resis-
tance between each blade of the attachment plug and acces-
sible conductive parts (Note 1) should be more than 1M-
ohm.
Note 1:
Accessible Conductive Parts include Metal panels,
Input terminals, Earphone jacks,etc.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field
effect transistors and semiconductor chip components.
The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor compo-
nent or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known
earth ground. Alternatively, obtain and wear a commer-
cially available discharging wrist strap device, which
should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such
as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static solder removal device. Some
solder removal devices not classified as “anti-static” can
generate electrical charges sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can
generate an electrical charge sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protec-
tive package until immediately before you are ready to
install it. (Most replacement ES devices are packaged with
leads electrically shorted together by conductive foam,
aluminum foil,or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the
device will be installed.
Caution: Be sure no power is applied to the chassis or
circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Normally harmless motion such
as the brushing together of your clothes fabric or the lifting
of your foot from a carpeted floor can generate static elec-
tricity sufficient to damage an ES device.)
Summary of Contents for HCS6000A
Page 27: ...3 17 FIG 06 Digital Stream Input to IC400 FIG 07 Interrupt Request Signal on R418 ...
Page 31: ...3 21 FIG 13 27MHz NTSC encoder pixel clock FIG 14 Composite Output top ...
Page 35: ...3 25 FIG 05 DVI output at 480i even field FIG 06 DVI output at 480i odd field ...
Page 45: ...CIRCUIT DIAGRAMS 1 CPU SYSTEM MEMORY CIRCUIT DIAGRAM 3 35 3 36 ...
Page 46: ...3 37 3 38 2 CPU PERI IR IN AUX CTRL CIRCUIT DIAGRAM ...
Page 47: ...3 39 3 40 3 TERRESTRIAL FRONT_END CIRCUIT DIAGRAM ...
Page 48: ...3 41 3 42 4 HD2 SDRAM CIRCUIT DIAGRAM ...
Page 49: ...3 43 3 44 5 DVI TRANSMITTER CIRCUIT DIAGRAM ...
Page 50: ...6 VDP I F DISPLAY OUTPUT CIRCUIT DIAGRAM 3 45 3 46 ...
Page 51: ...3 47 3 48 7 NTSC AUDIO PROCESSOR CIRCUIT DIAGRAM ...
Page 52: ...3 49 3 50 8 POWER REGULATION CIRCUIT DIAGRAM ...
Page 53: ...3 51 3 52 9 MPI CIRCUIT DIAGRAM ...
Page 54: ...3 53 3 54 10 PTC CIRCUIT DIAGRAM ...
Page 55: ...3 55 3 56 11 BACK PLANE CIRCUIT DIAGRAM ...
Page 56: ...3 57 3 58 PRINTED CIRCUIT DIAGRAMS 1 DIGITAL MAIN PRINTED CIRCUIT DIAGRAMS TOP ...
Page 57: ...3 59 3 60 2 DIGITAL MAIN PRINTED CIRCUIT DIAGRAMS BOTTOM ...
Page 58: ...3 61 3 62 3 MPI PRINTED CIRCUIT DIAGRAM TOP TOP VIEW BOTTOM VIEW ...
Page 59: ...3 63 3 64 4 PTC PRINTED CIRCUIT DIAGRAM TOP VIEW BOTTOM VIEW ...
Page 60: ...3 65 3 66 5 BACK PLANE PRINTED CIRCUIT DIAGRAM TOP VIEW BOTTOM VIEW ...