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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. BB Circuit Technical brief
GW520 service manual
3.2.1 General description
S-GOLD®3H
is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a
mixed signal baseband IC combined with a 3G coprocessor IC, providing all analog and digital
functionality for a dual mode mobile phone in a single chip.
Both ICs building up the
S-GOLD®3H
SiP are manufactured in infineon Technologies` 1.35V 90nm
CMOS technology to meet the ever increasing demands of the market for feature rich and high
performance terminals at low costs.
The chip will support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD®3H
support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external
hardware.
3.2.2. Block Description
z
Processing core
- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate
Motion Estimation algorithms with based video encoding schemes..
- TEAKLite DSP core
z
ARM9-Memory
- 32k Byte Boot ROM on the AHB
- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 32k Byte Instruction Cache
- 32k Byte Data Cache
- 8k Byte Instruction Tightly coupled Memory (I-TCM)
- 8k Byte Data tightly coupled memory (D-TCM)
z
TEAKLite®-Memory
- 120k x 16bit Program ROM
- 8k x 16bit Program RAM
- 72k x 16bit Data ROM
- 48k x 16bit Data XRAM
- 5k x 16bit Data YRAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
