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ESD PRECAUTIONS
[Electrostatically Sensitive Devices (ESD)]
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are ready
to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER
SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ESD device).
[CAUTION. GRAPHIC SYMBOLS]
- 1-4 -
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL
TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE
OF UNINSULATED “DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT
MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO
ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY
INFORMATION IN SERVICE LITERATURE.
Summary of Contents for CD-372A
Page 16: ... 2 11 INTERNAL BLOCK DIAGRAM OF ICs LC72131 Block Diagram Pin Assignments Top View ...
Page 17: ... 2 12 Pin Assignments Top View TDA7440D Block Diagram ...
Page 18: ... 2 13 S3C8248 Block Diagram Pin Assignments Top View ...
Page 19: ... 2 14 TA2149BN Block Diagram KIA8207K TA8207K Block Diagram ...
Page 20: ... 2 15 TDA2104 MP3 DECODER Block Diagram Pin Assignments Top View ...
Page 23: ...2 20 2 21 BLOCK DIAGRAM ...
Page 24: ...2 22 2 23 SCHEMATIC DIAGRAMS 1 MAIN SCHEMATIC DIAGRAM ...
Page 25: ...2 24 2 25 2 µ COM SCHEMATIC DIAGRAM ...
Page 26: ...2 26 2 27 2 µ COM SCHEMATIC DIAGRAM FOR MP3 ...
Page 27: ...3 TUNER SCHEMATIC DIAGRAM 2 28 2 29 ...
Page 28: ...2 30 2 31 4 CD SCHEMATIC DIAGRAM ...
Page 29: ...4 CD SCHEMATIC DIAGRAM FOR MP3 2 32 2 33 ...
Page 30: ...2 34 2 35 5 DECODER SCHEMATIC DIAGRAM FOR MP3 ...
Page 31: ... WIRING DIAGRAM 2 36 2 37 ...
Page 32: ...2 38 2 39 PRINTED CIRCUIT BOARD DIAGRAMS 1 MAIN P C BOARD DIAGRAM COMPONENT SIDE ...
Page 33: ...2 40 2 41 1 MAIN P C BOARD DIAGRAM SOLDER SIDE ...
Page 35: ...3 CD P C BOARD DIAGRAM COMPONENT SIDE 2 44 2 45 3 CD P C BOARD DIAGRAM SOLDER SIDE SIDE ...
Page 37: ...3 3 3 4 MEMO MEMO ...