- 22 -
LGE Internal Use Only
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
2. 3D Model
(P
11
01
)
30P
HD
LV
DS
waf
er
51P
F
HD
LV
DS
waf
er
(P
11
00
)
C
OM
P2_
L/
R
_I
N
C
OM
P2_
Y+
/A
V_C
VB
S_
IN
, C
OM
P2_
Pb
+/
Pr
+
C
K
+/
-,
D
0+
/-,
D
1+
/-,
D
2+
/-_H
D
M
I2
D
D
C
_SC
L/
SD
A_
2,
H
D
M
I_C
EC
Se
ria
l F
la
sh
(8
M
bi
t)
IC
13
00
SPI
_SC
K
/SD
I/SD
O/
C
S
Sy
st
em
E
EP
R
O
M
(2
56
K
bi
t)
IC
10
4
I2C
_SC
L/
SD
A
N
A
N
D
F
LA
SH
(1Gb
it)
IC
10
2
PC
M
_A
[0
-7],
…
<
FH
D
>
R
XA
0+
/-~
R
XA
4+
/-,
R
XA
C
K
+/
-
R
XB
0+
/-~
R
XB
4+
/-,
R
XB
C
K
+/
-
SP
K
_R
SP
K
_L
AM
P_SC
L/
SD
A
AU
D
_M
AST
ER
_C
LK
,
AU
D
_L
R
C
H
,
AU
D
_L
R
C
K
, A
U
D
_SC
K
TA
S5
73
3
(IC
56
00
)
M
ai
n
SO
C
M
1A
-1
28
M
B
내
장
(IC
10
1)
C
on
ne
ct
or
(P
60
0)
K
EY1/
2,
L
ED
_R
, I
R
R
EA
R
H
D
M
I1
(JK
801
)
TU
_SC
L
/ SD
A
SI
F
D
_I
F
C
VB
S
C
omp
1
&
A
V1
(JK
170
1)
SPD
IF
_OU
T
SPD
IF
(Op
tic
)
(JK
100
1)
SI
D
E
U
SB
(J
K7
00
)
H
D
M
I2
(M
H
L)
(J
K8
03
)
C
K+
/-,
D
0+
/-
, D
1+
/-
, D
2+
/-
,_
H
D
M
I4,
D
D
C
_SC
L/
SD
A_
4,
H
D
M
I_C
EC
SI
D
E_U
SB_D
M
/D
P
U
SB1_
OC
D
/C
TL
TP
S6
52
82
+5
V_
U
SB
M
H
L_C
D
_SEN
SE
H
P_L/
R
OU
T,
SI
D
E_
H
P_
M
U
TE
H
ead
pho
ne
(J
K1
50
0)
<
H
D
>
R
XA
0+
/-~
R
XA
3+
/-,
R
XA
C
K
+/
-
D
D
R
3
SD
R
A
M
(1
G
bi
t)
IC
12
01
B
-M
D
QL
[0
-7
],
B
-M
D
QU
[0
-7],
…
D
D
R
C
LK
(M
ax
) :
792
M
H
z
Summary of Contents for BUSWLJR
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