T/C 3D M
odello
(P
1801
)
30P
HD LV
DS wafe
r
51P
FHD
LVDS
wafer
(P
1800)
CO
MP
2_L/
R_
IN
CO
MP
2_Y+
/AV_C
VBS_
IN,
CO
MP
2_Pb
+/
Pr
+
CK
+/
-,
D0
+/
-,
D1
+/
-,
D2
+/
-_
HDMI
2
DDC
_S
CL
/S
DA
_2
, HDMI
_C
EC
Se
rial
Fl
as
h
(8
Mb
it)
IC1300
SPI
_S
CK
/S
DI/S
DO
/CS
Sy
st
em
EEPR
OM
(2
56
Kb
it)
IC10
4
I2
C_
SC
L/
SD
A
R
XA0
+/
-~
R
XA4
+/
-, RX
AC
K+
/-
R
XB0
+/
-~
R
XB4
+/
-, RX
BC
K+
/-
SPK_
R
SPK_
L
AM
P_SC
L/
SD
A
AU
D_
M
AST
ER
_C
LK
,
AU
D_
LR
CH
,
AU
D_
LR
CK
, A
UD_
SC
K
ST
A3
80
BW
(IC3
401)
Ma
in
SO
C
M1
A
-128
MB
Imbedded
(IC1
01
)
Co
nn
ec
to
r
(P
4600
)
KEY1
/2
, LE
D_
R,
IR
R
EAR
HDMI
1
(J
K4200)
F-
SC
AR
T
(J
K2801)
SPD
IF_
OU
T
SPD
IF
(Opt
ic
)
(J
K1001)
SI
DE
US
B
(J
K700)
HDMI
2(
MH
L)
(J
K4201)
CK
+/
-,
D0
+/
-,
D1
+/
-,
D2
+/
-,_
HDMI4
, DDC_
SC
L/
SD
A_4,
HDMI_
CE
C
SI
DE
_U
SB_
DM/D
P
U
SB1_O
CP
/C
TL
TP
S65282
+5
V_
US
B
MH
L_
CD_
SEN
SE
HP
_L
/R
OU
T,
SI
DE
_H
P_
MU
TE
H
eadphone (J
K3000)
DDR3
SD
RA
M
(1
Gb
it)
IC1201
B-
MD
QL
[0
-7
],
B-
MD
QU
[0
-7
],…
TU
_S
CL
/
SD
A
H/NI
M
IF_
P
IF
_N
IF
_AGC
AV
DD5
V_
MH
L,
MH
L_OC
P
CI Slot(P1900)
NA
ND
FLAS
H
IC
102
(1
Gbit
)
H2
7U1G8F
2C
TR
-B
C
PC
M_
A[
0:
7]
TC
74LC
X2
44
FT
Bu
ff
er
TS
_D
AT
A[
0:
7]
PC
M_
DA
TA
[0
:7
]
FE
_T
S_DA
TA
[0
:7
]
CO
MP
ON
EN
T
(J
K2802)
5V_H
DMI_
4
PC
M_
A[
8:
14
]
X-
ta
l
24M
SC
1/
AV2_C
VBS_
IN
,
DT
V/
MN
T_
OU
T,
DT
V/
MN
T_
L/
R_
OU
T
SC
1_
R+
/G
+/
B+
, CO
M1
_Y
+/
Pb
+/
Pr+
T/C 3D Model
