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Copyright              LG Electronics. Inc. All right reserved. 
Only for training and service purposes

LGE Internal Use Only

- 4 -

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE:  If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.

General Servicing Precautions
1.  Always unplug the receiver AC power cord from the AC power

source before;
a.  Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b.  Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.

2.  Test high voltage only by measuring it with an appropriate high

voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3.  Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specified otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.

5.  Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6.  Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are
correctly installed.

7.  Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8.  Use with this receiver only the test fixtures specified in this

service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.

Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1.  Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

unit under test.

2.  After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.

3.  Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.

5.  Do not use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6.  Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).

7.  Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting  of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)

General Soldering Guidelines
1.  Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within the
range or 500

°F to 600°F.

2.  Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3.  Keep the soldering iron tip clean and well tinned.
4.  Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5.  Use the following unsoldering technique

a.  Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b.  Heat the component lead until the solder melts.
c.  Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

6.  Use the following soldering technique.

a.  Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b.  First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c.

Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d.

Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Summary of Contents for 26LH20R

Page 1: ... SERVICING THE CHASSIS READ THE SAFETY PRECAUTIONS IN THIS MANUAL CHASSIS LP91A MODEL 26LH20R 26LH20R MA North Latin America http aic lgservice com Europe Africa http eic lgservice com Asia Oceania http biz lgservice com Internal Use Only ...

Page 2: ...nc All right reserved Only for training and service purposes LGE Internal Use Only 2 CONTENTS CONTENTS 2 PRODUCT SAFETY 3 SPECIFICATION 6 ADJUSTMENT INSTRUCTION 11 TROUBLE SHOOTING 16 BLOCK DIAGRAM 19 EXPLODED VIEW 20 SVC SHEET ...

Page 3: ...heck Antenna Cold Check With the instrument AC plug removed from AC source connect an electrical jumper across the two AC plug prongs Place the AC switch in the on position connect one lead of ohm meter to the AC plug prongs tied together and touch other ohm meter lead in turn to each exposed metallic parts such as antenna terminals phone jacks etc If the exposed metallic part has a return path to...

Page 4: ...n your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge b...

Page 5: ...e solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replaced...

Page 6: ... products is marked by models 4 Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM 5 The receiver must be operated for about 5 minutes prior to the adjustment 3 Test method 1 Performance LGE TV test method followed 2 Demanded other specification Safety CE IEC specification EMC CE IEC No Item Specification Measurement Remark...

Page 7: ...Picture mode Vivid 8 Component Video Input Y PB PR No Specification Remark Resolution H freq kHz V freq Hz Pixel Clock MHz 1 720 480 15 73 59 94 13 500 SDTV DVD 480I 525I 2 720 480 15 75 60 00 13 514 SDTV DVD 480I 525I 3 720 576 15 625 50 00 13 500 SDTV DVD 576I 625I 50Hz 4 720 480 31 47 59 94 27 000 SDTV 480P 5 720 480 31 50 60 00 27 027 SDTV 480P 6 720 576 31 25 50 00 27 000 SDTV 576P 50Hz 7 128...

Page 8: ... 363 60 004 65 00 VESA XGA 4 1280 x 768 47 776 59 87 79 5 VESA WXGA 5 1360 x 768 47 72 59 799 84 62 VESA WXGA 6 1366 x 768 47 7 60 00 84 62 WXGA 7 1280 x 1024 63 595 60 00 108 875 SXGA 8 1920 x 1080 66 647 59 988 138 625 WUXGA 10 2 DTV Mode No Specification Remark Resolution H freq kHz V freq Hz Pixel Clock MHz 1 720 x 480 15 73 59 94 13 500 SDTV DVD 480I 525I 2 720 x 480 15 75 60 00 13 514 SDTV D...

Page 9: ...Back cover and Middle Cabinet 0 b B Side gap Gap a between Front Frame and Middle Cabine 0 a A Side gap b a Gap a between Front Frame and Middle Cabine 0 a A Left Right gap 3 Gap between Back Cover and Side AV Back View Side View Side AV Back Cover Gap f between Back Cover and Side AV 0 f 1 0 Gap g between Back Cover and Side AV 0 g 1 0 11 Mechical spec No Item Min Typ Max Unit 1 C A B C top gap 0...

Page 10: ... right of active area and bezel C Interval between top of active area and bezel D Interval between bottom of active area and beze 4 Gap between Back Cover and Side AV 10 LGE Internal Use Only Copyright LG Electronics Inc All right reserved Only for training and service purposes Side View h Control Braket Back Cover Gap h between Back Cover and Control Bracket 0 h 0 8 C B D A Active Area Bezel ...

Page 11: ...r must keep 100 220V 50 60Hz 5 Before adjustment execute Heat Run for 5 minutes at RF no signal 3 Adjustment items 3 1 PCB assembly adjustment items 1 Download the MSTAR main software IC800 Mstar ISP Utility 1 Using D L Jig 2 Using USB Memory Stick 2 ADC Calibration RGB Component 3 Input Tool Option Area option 4 Check SW Version 4 PCB assembly adjustment method 4 1 Mstar Main S W program download...

Page 12: ...connect the MSPG equipment There are two methods of downloading the edid data 4 4 1 1st Method EDID datas are automatically downloaded when adjusting the Tool Option2 Automatically downloaded when pushing the enter key after adjusting the tool option2 It takes about 2seconds 4 4 2 2nd Method Caution Must be checked that the tool option is right or not If tool option is wrong hdmi edid data could n...

Page 13: ...and press ENTER A 6 ADC adjustment is executed automatically 7 When ADC adjustment is finished this OSD appear 4 5 2 ADC Calibration RGB Using External pattern 1 Required Equipments Remote controller for adjustment MSPG 925F MSPG 1025 MSPG 3233 Pattern Generator 2 Process 1 Change the Input to RGB mode 2 Input the PC 1024x768 60Hz Horizontal Color Bar signal into RGB MSPG 925F Model 60 Pattern 65 ...

Page 14: ...e power on by power only key Maintain the DDC adjustment mode with same condition of Heat run Maintain after AC off on in status of Heat run pattern display 2 Release the DDC adjustment mode Release the adjust mode after AC off on or std by off on in status of finishing the Hear run mode Release the Adjust mode when receiving the aging off command F3 00 00 from adjustment equipment Need to transmi...

Page 15: ...decreasing the G 4 Standard color coordinate and temperature when using the CA100 or CA210 equipment To check the Coordinates of White Balance you have to measure at the below conditions Picture Mode User 1 Dynamic Contrast Off Dynamic Colour Off If you miss the upper condition the coordinates of W B can be lower than the spec 15 LGE Internal Use Only Copyright LG Electronics Inc All right reserve...

Page 16: ...Assy A PROCESS Fail Fail Pass Pass Check LEDAssy Change IC1002 Q1003 Pass Check short of IC1001 IC1003 IC1007 Fail Re soldering or Change defect part of IC1001 IC1003 IC1007 Fail No Raster B Process Check LED status On Display Unit Repeat A PROCESS Pass Fail Check Output of IC802 Change IC802 Fail Change Inverter Connector Or Inverter Fail Pass Fail Pass Change Module Fail Check LVDS Cable Pass Ch...

Page 17: ...art Pass No Raster on COMMPONENT Signal Check Input source Cable And Jack Pass Re soldering or Change the defect part Pass Check the Input Output Of IC800 Fail Re soldering or Change the defect part Repeat A B Process Check The Input Output Of JK101 Fail Pass No Raster on HDMI Signal Check Input source Cable And Jack Pass Check the Input Output Of JK301 JK302 JK303 Fail Re soldering or Change the ...

Page 18: ...e defect part Pass Fail Pass Repeat A B Process Check the Input Output Of IC800 Fail Re soldering or Change the defect part Pass Check The Input Output Of TU500 Pass Re soldering or Change the defect part Pass Fail Check the Input Output Of IC800 Fail Re soldering or Change the defect part Repeat A B Process No Sound Check The Input Sourse Check The Input Output Of IC600 Re soldering or Change the...

Page 19: ...DM 2_SCL SDA PC_SCL SDA MNT_VOUT AV2_VIN AV2_LIN RIN IIS_OUT USB USB_DN PN AUDIO AMP HDMI3_SCL SDA EEPROM 24C02 HDMI_DATA_3 TMDS TMDS TMDS HDMI3 USB For D L EEPROM 256K Serial Flash 8MByte RGB_PC PC_Audio TV RF COMP1 HDMI1 HDMI2 RS232 TX 232C Driver ST3232C PC_R G B HS VS PC_Audio_L R 700mVrms MNT_OUT 1Vpp SIDE_V 1Vpp SIDE_L SIDE_R 500mVrms DDR2 512MB EEPROM 24C02 Comp1_L R 500mVrms TUNER AV1_VIN ...

Page 20: ...d mechanical parts in this chassis have special safety related characteristics These parts are identified by in the Schematic Diagram and EXPLODED VIEW It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X RADIATION Shock Fire or other Hazards Do not modify the original design without permission of manufacturer IMPORT...

Page 21: ...52 I2C_OUT_SD3 147 GND_8 148 GPIO51 149 GPIO52 150 GPIO53 151 GPIO54 152 GPIO55 153 GPIO56 154 GPIO57 155 GPIO58 156 VDDP_3 157 VDDC_5 158 B_MDATA 4 159 B_MDATA 3 160 GND_9 161 B_MDATA 1 162 B_MDATA 6 163 AVDD_DDR_1 164 B_MDATA 11 165 B_MDATA 12 166 GND_10 167 B_MDATA 9 168 B_MDATA 14 169 AVDD_DDR_2 170 B_DDR2_DQM 1 171 B_DDR2_DQM 0 172 GND_11 173 B_DDR2_DQS 0 174 B_DDR2_DQSB 0 175 AVDD_DDR_3 176 ...

Page 22: ...8 A8 L1 NC4 L2 BA0 R8 NC3 K7 RAS F8 VSSQ3 F3 LDM P3 A9 M3 A1 N3 A5 K8 CK R3 NC5 L3 BA1 J7 VSSDL L7 CAS F2 VSSQ4 B3 UDM M2 A10 AP K2 CKE R7 NC6 M7 A2 N7 A6 M8 A0 J1 VDDL K3 WE E8 LDQS P7 A11 K9 ODT A2 NC1 N2 A3 P2 A7 H8 VSSQ1 F7 LDQS A8 UDQS R2 A12 L8 CS E2 NC2 E7 VSSQ5 D8 VSSQ6 D2 VSSQ7 A7 VSSQ8 B8 VSSQ9 B2 VSSQ10 P9 VSS1 N1 VSS2 J3 VSS3 E3 VSS4 A3 VSS5 G9 VDDQ1 G7 VDDQ2 G3 VDDQ3 G1 VDDQ4 E9 VDDQ5...

Page 23: ... 1 ADJ GND 2 OUTPUT 3 INPUT 10uF 16V C1017 10uF 16V C1018 AP1117EG 13 IC1002 1 ADJ GND 2 OUT 3 IN 1K R1044 DC_DIM 1K R1076 OPC_DISABLE 1K R1075 OPC_ENABLE 0 R1013 2 2K R1050 2 2K R1051 2 2K R1052 68uF 35V C1006 0 R1012 NON 19_22 3 6uH L1009 CIC21J501NE EAM58113401 L1000 CIC21J501NE L1008 FW20020 24S P1000 NON_19_22_26 19 NC 14 12V 9 5 2V 4 GND 18 24V 13 12V 8 5 2V 3 GND 17 24V 12 GND 7 5 2V 2 Powe...

Page 24: ..._OPT 0 R673 12 R658 12 R653 12 R621 12 R654 4 7K R628 4 7K R667 3 3 R671 3 3 R635 1K R607 10K NON_HOTEL_OPT R613 12K HOTEL_OPT R613 5 6K R614 5 6K R615 10K NON_HOTEL_OPT R616 12K HOTEL_OPT R616 1K R609 4 7K R606 200 HOTEL_OPT R612 10K HOTEL_OPT R617 0 HOTEL_OPT R620 0 HOTEL_OPT R619 4 7K R605 33pF C631 33pF C633 0 1uF C620 0 1uF C622 6 8K R618 6 8K R622 NTP 3100L IC600 1 BST1A 2 VDR1A 3 RESET 4 AD...

Page 25: ...C_8 18 NC_7 10 SCL 4 NC_2 1 NC_1 17 NC_6 9 SDA 8 GND_2 3 B 5V 16 SIF OUT 7 NC_3 6 TP 3 3V_OPT 15 A OUT 21 SHIELD 20 NC_9 4 7K R502 220 R506 220 R507 100uF16V C505 100uF16V C509 100uF16V C506 120 ohm L501 47 R504 47 R505 0 1uF 50V C503 0 L501 1 0 Ohm N e a r t h e p i n THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTR...

Page 26: ... 5 SDA 6 SCL 7 WP 8 VCC DDC_WP DDC_WP DDC_WP BSS83 CEC_READY Q303 S B D G CEC 3 3V_MST CEC_C CDS3C30GTH 30V CEC_READY D304 MMBD301LT1G 30V CEC_READY D303 10K R301 1K R303 0 01uF C300 10K R300 1K R302 100 R329 1K R314 10K R312 68K CEC_READY R315 0 R313 100 R317 100 R318 100 R305 100 R304 0 01uF C301 100 R331 100 R306 100 R307 0 01uF C302 100 R327 10K R308 10K R310 10K R309 10K R311 10K R319 10K R32...

Page 27: ...7 PSJ014 01 JK101 S VIDEO GND 6 1 C LUG1 2 C LUG2 3 0 SPRING 4 C LUG3 5 C LUG4 SHIELD 7 75 R102 0 HOTEL_OPT R103 0 HOTEL_OPT R105 0 NON_HOTEL_OPT R106 0 HOTEL_OPT R101 75 R109 75 R108 75 R107 220K R104 12K R118 12K R117 12K R119 12K R120 10K R113 10K R115 10K R116 220K R100 220K R111 220K R112 75 R110 75 R122 S VIDEO 75 R121 S VIDEO 10K R123 100pF READY C103 10K R114 PPJ226 01 JK100 9A GN 1P_CAN 4...

Page 28: ...209 30V D208 READY 30V D207 READY USB_DL_N USB_DL_P 0 REAR_USB R229 0 REAR_USB R230 USB DOWN STREAM UB01123 4HHS 4F JK205 REAR_USB 1 2 3 4 5 0 1uF C203 0 1uF C200 0 1uF C201 0 1uF C202 0 01uF C205 0 1uF C204 0 1uF C206 0 1uF C207 100 R202 100 R203 75 R227 220K R223 READY 220K R222 READY 12K R226 12K R228 75 R211 75 R212 75 R213 4 7K R214 4 7K R215 220K R231 220K R232 10K R233 10K R234 12K R235 12K...

Page 29: ...12 470 R435 OPC_ENABLE SMAW200 03 P404 19_22_26 1 KEY1 2 KEY2 3 GND 120 ohm L404 120 ohm L407 NON_19_22_26 TF05 51S P401 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 FF10001 30 P402 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 SMW200 28C P403 1 2 3 4 5 6 7 8 ...

Page 30: ...Feb 2009 Printed in Korea P NO MFL60021514 ...

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