LA02303B BLE Module Specification
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Better Life with Better IoT Innovation 13 / 20
5.2
PCB Pads Information
Figure 5.2 Pad Size
5.3
Plug-in Land Pattern Example
Figure 5.3 Plug-in PCB Land Pattern
Note:
Black printing is PCB slot, the size tolerance should be +0.1/-0mm, the thickness of the PCB
should be 1.2mm or 1.6mm;
The red solder pad is to drag solder water across, it is not the solder pad for the module. During
wave soldering it is used to drag the solder paste water across, so that it will not be soldered
together
with the module’s solder pads;
It is suggested to add silk printing between the pads to avoid them welded together;