3
MachXO2-1200ZE Breakout Board
Lattice Semiconductor
Evaluation Kit User’s Guide
Figure 1. MachXO2-1200ZE Breakout Board, Top Side
Two 2x20
Header Landings
(J3, J5)
Two 2x20
Header Landings
(J2, J4)
MachXO2-1200ZE
PLD (U3)
FTDI
USB to UART/FIFO
IC (U1)
JTAG Header
Landing (J1)
USB Mini-B
Socket (J7)
Power LED
(PWR_ON)
Power/GND
Test Points
(TP1, TP2, TP3)
4x15 60-Hole
Prototype Array (J6)
LED Array (J4)
Storage and Handling
Static electricity can shorten the lifespan of electronic components. Please observe these tips to prevent damage
that could occur from electro-static discharge:
• Use anti-static precautions such as operating on an anti-static mat and wearing an anti-static wrist-band.
• Store the evaluation board in the packaging provided.
• Touch a metal USB housing to equalize voltage potential between you and the board.
Software Requirements
You should install the following software before you begin developing new designs for the Breakout board:
• Lattice Diamond
®
design software
• FTDI Chip USB hardware drivers (installed as an option within the Diamond installation program)
MachXO2-1200ZE Device
This board features the MachXO2-1200ZE PLD which offers embedded Flash technology for instant-on, non-vola-
tile operation in a single chip. Numerous system functions are included, such as a PLL and 64Kbits of embedded
RAM plus hardened implementations of I
2
C, SPI, timer/counter, and user Flash memory. Flexible, high perfor-
mance I/Os support numerous single-ended and differential standards including LVDS, and also source synchro-
