ML7406 Family LSIs Hardware Design Manual
FEXL7406DG-01
i
Notes
1)
The information contained herein is subject to change without notice.
2)
Although LAPIS Semiconductor is continuously working to improve product reliability and quality, semiconductors can
break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure,
please take safety measures such as complying with the derating characteristics, implementing redundant and fire
prevention designs, and utilizing backups and fail-safe procedures. LAPIS Semiconductor shall have no responsibility
for any damages arising out of the use of our Products beyond the rating specified by LAPIS Semiconductor.
3)
Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate
the standard usage and operations of the Products.The peripheral conditions must be taken into account when designing
circuits for mass production.
4)
The technical information specified herein is intended only to show the typical functions of the Products and examples
of application circuits for the Products. No license, expressly or implied, is granted hereby under any intellectual property
rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this document;
therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute, concerning such rights owned by
third parties, arising out of the use of such technical information.
5)
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems,
gaming/entertainment sets) as well as the applications indicated in this document.
6)
The Products specified in this document are not designed to be radiation tolerant.
7)
For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and
consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships, trains), primary
communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and
power transmission systems.
8)
Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power
control systems, and submarine repeaters.
9)
LAPIS Semiconductor shall have no responsibility for any damages or injury arising from non-compliance with the
recommended usage conditions and specifications contained herein.
10)
LAPIS Semiconductor has used reasonable care to ensure the accuracy of the information contained in this document.
However, LAPIS Semiconductor does not warrant that such information is error-free and LAPIS Semiconductor shall have
no responsibility for any damages arising from any inaccuracy or misprint of such information.
11)
Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive.
For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS Semiconductor shall have no
responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
12)
When providing our Products and technologies contained in this document to other countries, you must abide by the
procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US
Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.
13)
This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Semiconductor.
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