
Dear customer
LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1
st
day of October,
2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which
LAPIS established a new company, LAPIS Technology Co., Ltd.
(“LAPIS
Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business.
Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"
and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."
Furthermore, there are no changes to the documents relating to our products other than
the company name, the company trademark, logo, etc.
Thank you for your understanding.
LAPIS Technology Co., Ltd.
October 1, 2020
Summary of Contents for ML630Q791
Page 2: ...FEBL630Q791 01 ML630Q791 SDK BOARD Hardware Manual ML630Q791 Demo Kit Issue Date Jun 12 2015...
Page 15: ...Chapter 3 Setting This chapter gives a Setting opreating mode of the ML630Q791 SDK Board...
Page 18: ...Chapter 4 Connectors This chapter describes the connectors mounted on the ML630Q791 SDK Board...
Page 22: ...Chapter 5 Notes This chapter describes the Notice when ML630Q791 SDK Board is used...
Page 24: ...Chapter 6 Schematics This chapter describes the schematics of ML630Q791 SDK Board...
Page 26: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 2 FEBL630Q791 01...
Page 27: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 3 FEBL630Q791 01 6 2 CPU board...
Page 28: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 4 FEBL630Q791 01...
Page 29: ...ML630Q791 SDK Board Hardware Manual Chapter 6 Schematics 6 5 FEBL630Q791 01...