Dear customer
LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1
st
day of October,
2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which
LAPIS established a new company, LAPIS Technology Co., Ltd.
(“LAPIS
Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business.
Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"
and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."
Furthermore, there are no changes to the documents relating to our products other than
the company name, the company trademark, logo, etc.
Thank you for your understanding.
LAPIS Technology Co., Ltd.
October 1, 2020
Summary of Contents for ML610Q174
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