Lanner LEC-6041B, User Manual

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LEC-6041 User Manual
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3. Insert the modules into the corresponding sockets.

For the DDR2, please handle the heat sink screws with a torque screwdriver to ensure the tightening
to a torque of
0.5 kg.cm .

For the mSATA module and the mPCIe module, secure them onto the motherboard using the
provided screws, and attach a thermal pad to the surface of each. Please note, it is recommended to
purchase the mSATA module and the mPCIe module from Lanner, for the thermal pads that come
with the package were specifically chosen to fit into the gap between the selected modules and the
heat sink. If you prefer to use other modules, their thicknesses are very likely to differ from those of
Lanner-supplied ones (mSATA: 3.7mm / mPCIe: 2.5mm), which means you may have to replace the
provided thermal pads with suitable ones.
4. Make sure you secure the heat sink onto the chassis with the provided screws.
Max screw driver torque
=0.5 kg.cm
2x Thermal Pad for mSATA/mPCIe modules
2x Screws for Heat sink
2x Screws for fixture of mSATA/mPCIe modules