LoRa/BLE Modules
Hardware Integration Guide
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Manual. This Application Note is considered a living document and will be updated as new information is
presented.
The modules are designed to meet the needs of a number of commercial and industrial applications. They are
easy to manufacture and conform to current automated manufacturing processes.
Shipping
Figure 8: RM1xx Shipping Tray Details
Reflow Parameters
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New
packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained
during storage and shipment. If directed to bake units on the card, see
and follow instructions specified
by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website:
http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Modules are shipped in ESD (Electrostatic
Discharge) safe trays that can be loaded
into most manufacturers pick and place
machines. Layouts of the trays are
provided in
