BL600-Sx Hardware Integration Guide
Single Mode BLE Module
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42
CONN-HIG-BL600
8.3
Reflow Parameters
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption.
New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level
maintained during storage and shipment. If directed to
bake units
instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website:
http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Note:
The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures
displayed in in
, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate
and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in
ambient environment
30°C/60%RH.
Table 20: Recommended baking times and temperatures
MSL
125
°
C
Baking Temp.
90
°
C/
≤
5%RH
Baking Temp.
40
°
C/
≤
5%RH
Baking Temp.
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
3
9 hours
7 hours
33 hours
23 hours
13 days
9 days
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform
to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 8-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in
