KTQ77/Flex Users Guide
KTD-N0848-B Page 11
2 System Specification
2.1 Component main data
The table below summarizes the features of the KTQ77/Flex embedded motherboard.
Form factor
KTQ77/Flex: Flex-ATX (190,5 mm by 228,6 mm)
Processor
Support the following Intel® Core™ processors via Socket H2 (LGA1155), ZIF Socket
•
Intel® Core™ i7, 2
nd
and 3
rd
Generation
•
Intel® Core™ i5, 2
nd
and 3
rd
Generation
•
Intel® Core™ i3, 2
nd
and 3
rd
Generation
•
1333/1600MHz system bus and 3/6/8MB internal cache.
•
Up to 95W (Thermal Guideline)
•
PCIe x16 (PEG) Gen3.0
Memory
•
4x DDR3 UDIMM 240pin socket
•
Support single and dual ranks DDR3 1066/1333/1600MT/s
(PC3-8500/PC3-10600/PC3-12800)
•
Support system memory from 1GB and up to 4x 8GB
Note: Less than 4GB displayed in System Properties using 32bit OS
(Shared Video Memory/PCI resources is subtracted)
•
ECC not supported
Chipset
Intel Q77 PCH (Platform Controller Hub)
•
Intel ® VT-d (Virtualisation Technology for Directed I/O)
•
Intel ® TXT (Trusted Execution Technology)
•
Intel ® vPRO
•
Intel ® AMT (Active Management Technology) version 8.0
•
Intel ® AT (Anti-Theft Technology)
•
Intel ® HD Audio Technology
•
Intel ® RST (Rapid Storage Technology)
•
Intel ® RRT (Rapid Recover Technology)
•
SATA (Serial ATA) 6Gb/s and 3Gb/s.
•
USB 4x rev. 3.0/2.0 + 10x rev. 2.0
•
PCIe x4 (in x16 slot) Gen2.0
•
ACPI 3.0b compliant
•
Triple Display support (Triple Graphic Pipes)
•
Blue-ray HD video playback
Security
•
Intel® Integrated TPM 1.2 support
Management
•
Intel® AMT (Active Management Technology) 8.0
Audio
Audio, 7.1 Channel High Definition Audio Codec using the VIA 1708B codec
•
Line-out
•
Line-in
•
Surround output: SIDE, LFE, CEN, BACK and FRONT
•
Microphone: MIC1 and MIC2
•
CDROM in
•
SPDIF (electrical Interface only)
•
On-board speaker (Electromagnetic Sound Generator like Hycom HY-05LF)
System Specification
