Keysight 11923A, Operating And Service Manual

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3 Mounting the Launch
22 Keysight 11923A Operating and Service Manual
Mounting the Launch
Creating the package or fixture wall
The launch is designed to be threaded into a 5-mm thick package wall. The user is responsible for
machining the package and installing the launch.
Figure 3-1 shows the machining detail for creating the package wall.
Figure 3-1 Section view of machining detail for the package wall
The following machining details are recommended to provide optimum connections. All
measurements are in millimeters (mm).
– The bottom of the 4.50 diameter hole must be flat for proper grounding.
– The edge between the package floor and the 4.50 diameter hole must be carefully deburred
with a minimum corner break.
– The centerline offset between the threaded and the package floor is calculated as follows:
Offset = substrate thi 0.081 (radius of pin) + 0.075 (clearance for solder flow)
– Gold plating is recommended for conductivity and corrosion protection.