P1
A
T1A
GEB10283A
2
R933
C939
R932
R931
R935
R936
R937
C93
5
PbF
MARK
UL
C936
C934
C93
8
C937
R938
<Sub board (for Except KD-R35E,35EY,38EE,411E,411EY,411EU,412E,412EY,412EU,417EE,KD-R416SUN,R419UR)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2010-08-05
No.MA465
(No.MA465<Rev.003>)19/37
Summary of Contents for KD-R35E
Page 29: ... No MA465 Rev 003 1 29 ...