LYB20112-001A
FOIL SIDE(B)
FOIL SIDE(B)
<02>REAR
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
LYB20112-001A
<03>JACK
COMPONENT SIDE(A)
COMPONENT SIDE(A)
<JACK CIRCUIT BOARD>
!
CAUTION :
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH SAME TYPE AND RATED FUSE(S).
ATTENTION :
POUR UNE PROTECTION PERMANENTE CONTRE LES RISQUE D'INCENDE,
REMPLACER LES FUSIBLES PAR UNAAUTRE DE MEME TYPE ET DE MEME TENSION.
UL MARK
PbF
PbF
3
0
AOI
PCB
S20
1
J20
3
J20
1
F20
1
F201
D20
1
CN203
CN201
LYA20112-
JACK PWB ASS'Y
TL902
TL901
S
69
4
S
69
3
S
69
2
S
69
1
R911
R910
R90
7
R906
R905
R902
R
69
5
R
69
4
R
69
3
L6
01
K
90
1
J60
2
J601
IC
901
D
60
5
D
60
1
C
N
60
1
C90
8
C90
7
C906
C905
C90
4
C903
C902
C
90
1
C611
BT
60
2
A
S
S
'Y
R
E
A
R
P
W
B
+
-
20112
LYA
PbF
PbF
UL MARK
R
61
0
R60
9
R
60
2
R60
1
Q601
L603
L602
F60
2
F602
F601
F60
1
D611
D61
0
D
60
9
D60
6
D
60
4
D
60
3
D
60
2
C
61
0
C
60
9
C
60
8
C60
7
C60
6
C60
4
C
60
3
C60
2
C
60
1
PCB
AOI
2
0
16
!
CAUTION :
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH SAME TYPE AND RATED FUSE(S).
ATTENTION :
POUR UNE PROTECTION PERMANENTE CONTRE LES RISQUE D'INCENDE,
REMPLACER LES FUSIBLES PAR UNAAUTRE DE MEME TYPE ET DE MEME TENSION.
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<REAR CIRCUIT BOARD>
Summary of Contents for GZ-EX210BUA
Page 5: ... No YF412 Rev 001 1 5 SECTION 3 DISASSEMBLY 3 1 Disassembly procedure Fig 3 1 1 ...
Page 6: ...1 6 No YF412 Rev 001 Fig 3 1 2 ...
Page 7: ... No YF412 Rev 001 1 7 Fig 3 1 3 ...
Page 8: ...1 8 No YF412 Rev 001 Fig 3 1 4 ...
Page 9: ... No YF412 Rev 001 1 9 Fig 3 1 5 ...
Page 10: ...1 10 No YF412 Rev 001 Fig 3 1 6 ...
Page 11: ... No YF412 Rev 001 1 11 Fig 3 1 7 ...
Page 12: ...1 12 No YF412 Rev 001 Fig 3 1 8 ...
Page 13: ... No YF412 Rev 001 1 13 Fig 3 1 9 ...
Page 14: ...1 14 No YF412 Rev 001 Fig 3 1 10 ...