Installing the NAE/NIE Technical Bulletin
15
•
Do
add additional devices to the enclosure as long as the
temperature of the processor is maintained below 77
°
C (171
°
F) per
the readout of the processor chip’s embedded temperature sensor.
(Read the temperature in the Diagnostics tab of the device object.
See the NAE Help system for more information on diagnostics.)
Note:
No general guidance can be given about the number of
heat-dissipating devices that can be mounted in a panel with the NAE.
The acceptable combinations of devices and mounting locations can be
determined only by testing the installation.
Mounting Space
Figure 9 shows the mounting space required for the NAE.
303 mm
(11.9 in.)
408 mm
(16.1 in.)
148 mm
(5.8 in.)
mountspace
DIN Rail
125 0.5 mm
(4.9 0.02 in.)
N2
-B
N2
-A
PO
W
E
R
+
-
RE
F
S
N2
+
-
RE
F
S
N2
+
NC
-
PO
W
E
R
E
THE
RN
E
T
10
/LI
N
K
10
0/LI
N
K
N2
A
N2
B
PEER
C
O
M
RU
N
24
V
A
C
B
ATT
FA
UL
T
GE
N
L
FA
UL
T
SER
IA
LB
SER
IA
L
A
U
SB A
U
SB B
ETHERNET
MODEM
S
YST
EM
RE
-B
O
O
T
NAE
R
ET SY
B A T T E R Y
DIN Rail
32 mm
(1.3 in.)
30 mm
(1.2 in.)
Figure 9: NAE Mounting Space
Correct Mounting Orientations
Wall and Cabinet/Enclosure Mount
See Figure 10 for correct wall and cabinet/enclosure mounting
orientations.
naewallmount
BEST
LO
N
L
O
N
A
L
O
N
B
S
H
IE
L
D
N
2-
B
N
2-
A
P
O
W
ER
+
-
R
E
F
S
N
2
+
-
R
E
F
S
N
2
+
N
C
-
S
E
R
IA
L
B
S
E
R
IA
L
A
U
S
B
A
U
S
B
B
OK
Figure 10: Wall and Cabinet/Enclosure Mount Orientation
