Jinan USR IOT Technology WIFI232-A, User Manual

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USR-WIFI232-A/B/C User Manual http://www.usriot.com
Jinan USR IOT Technology Limited Page 12 of 93 tec@usr.cn
2.5
2.5 2.5
2.5 Package
Package Package
Package Information
Information Information
Information
2.5.1 Recommended Reflow Profile
Figure 5
Reflow Reflow Reflow Reflow Soldering Soldering Soldering Soldering Profile Profile Profile Profile
Table 2
Reflow Soldering Parameter
Note: Note: Note: Note:
1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm).
2.5.2 Device Handling Instruction (Module IC SMT Preparation)
�
Shelf life in sealed bag: 12 months, at <30
℃
and <60% relative humidity (RH)
�
After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
� Recommend to oven bake with N2 supplied.
�
Baked required with 24 hours at 125
±
5
℃
before rework process for two modules, one is
new module and two is board with module.
�
Recommend to store at
≦
10% RH with vacuum packing.
� If SMT process needs twice reflow:
(1) Top side SMT and reflow à (2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168
hours window time, no need to bake within 168 hours.
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process.
Note:
Window time means from last bake end to next reflow start that has 168 hours space.
NO. NO. NO. NO. Item Item Item Item Temperature Temperature Temperature Temperature (Degree) (Degree) (Degree) (Degree)
Time(Sec) Time(Sec) Time(Sec) Time(Sec)
1 Reflow Time Time of above 220
35~55 sec
2 Peak-Temp 260 max