1
Chapter 1
Introduction of the Motherboard
1-1 Specification
Spec
Description
Design
Micro-ATX form factor; PCB size: 24.5 x24.5 cm
Chipset
Intel
®
Q87/H81 Express Chipset
CPU Socket
Supports Intel
®
Core™ i7, Core™ i5, Core™ i3 series, Pentium
®
processor in LAG1150 Package (Max. 65W TDP)
* for detailed CPU support information please visit our website
Memory Slot
NMF95-Q87:
DDRIII RAM module slot x 4 for
4 *
DDRIII
1600/1333 MHz RAM Module expandable to 32 GB (Maximum)
NMF95-H81
: DDRIII RAM module slot x 2 for
2 *
DDRIII 1600/1333
MHz RAM Module expandable to 16 GB (Maximum)
Support dual-channel function
Expansion Slot
1 * PCI-Express x16 slot
1 * PCI-Express x 4 slot
(NMF95-H81 running by x 2 bus)
2 *32-bit PCI slot
1 * Full-size MSATA/ Mini-PCIE slot
(NMF95-H81 only MSATA)
Storage
NMF95-Q87:
5 * SATAIII 6Gb/s port, support RAID 0/1/5/10 mode
NMF95-H81:
2 * SATAIII 6Gb/s port +1* SATAII 3Gb/s port
Dual LAN Chip
Integrated Intel® 82574L and i217-LM Gigabit Ethernet LAN chip
that supports Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
HD Audio Chip
Realtek ALC662 6-channel Audio Codec integrated
Audio driver and utility included
BIOS
64M Bit Flash ROM
Multi I/O
Rear Panel I/O:
Serial port connector x1
Display port connector x1
HDMI port connector x1
DVI-D port connector x1
VGA port connector x1
USB 3.0 port connector x2
USB 2.0 port connector x4
RJ-45 LAN connector x2
Audio connector x3 (Line-in/Optical SPDIF-out, Line-out, MIC)
Internal I/O Connectors& Headers:
1 *24-pin main power connector
1 *8-pin 12V Power connector
Front panel audio header x1
CDIN header x1
HDMI-SPDIF header x1
PS/2 KB & MS header x1
GPIO header x1
CIR header x1
TPM 1.2 header x1
NMF95-H81:
USB 2.0 header x1 (for 2* USB 2.0 expansion ports)
NMF95-Q87:
USB 2.0 header x2 (for4* USB 2.0 expansion ports)
NMF95-Q87:
USB 3.0 header x1 (for2* USB 3.0 expansion ports)
Front panel header x1
POWER LED header x1
Speaker header x1
COM port header x 9
SM_BUS header x1
LANLED header x2