6
2. Apply corresponding thermal conductive gels to the bottom side of the heat sinks as the photo
show, and then place the CPU, PWM IC and South Bridge heatsink upon the board. The screw
holes of the heatsink should match corresponding screw holes of the board.
3. Tighten up the screws to lock the heat sinks to the board, and then apply corresponding
thermal conductive gels to the top side of the heat sinks as the photo shows. When installation
finished, tear off the protective film from the gels before assembling the back cover to the
chassis.
Notice
: There should be one more
HCS310HS1-F/ HCS501HS1-F/ HCS501HS2-F/ HCS3XXHS2-F
left as
spare parts after normal assembly. User can use them to replace corresponding damaged thermal
conductive gels.
1: CPU Thermal conductive gel
(P/N:
HCS3XXHS2-F
*1 pcs), 20*20*0.5mm
2: PWM IC Thermal conductive gel
(P/N:
HCS501HS1-F
*1 pcs), 15* 47*1 mm
3: South Bridge Thermal conductive gel
(P/N:
HCS501HS2-F
*1 pcs), 25*25*1 mm
1: CPU Thermal conductive gel
(P/N:
HCS310HS1-F*1pcs
), 60*52*1.0mm
2: PWM IC Thermal conductive gel
(P/N:
HCS501HS1-F
*1pcs), 15* 47*1 mm
3: South Bridge Thermal conductive gel
(P/N:
HCS501HS2-F*1pcs
), 25*25*1 mm
