iv
Packing Item Checklist
5
Motherboard
5
Cable for IDE/Floppy
5
Cable for Serial ATA IDE Port(2pcs)
5
CD for motherboard utilities
□
Cable for USB Port 3/4 (Option)
5
User’s Manual
5
Cable for S-Video/RCA TV-Out (Option)
5
Cable for COM2 Port (Option)
AMD K8 Socket 939 Processor Thermal Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems. Maintaining
the proper thermal environment is key to reliable, long-term system operation. The overall
goal in providing the proper thermal environment is keeping the processor below its
specified maximum case temperature. Heatsinks induce improved processor heat
dissipation through increased surface area and concentrated airflow from attached fans. In
addition, interface materials allow effective transfers of heat from the processor to the
heatsink. For optimum heat transfer, AMD recommends the use of thermal grease and
mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for
collection of heatsinks evaluated and recommended by AMD for use with AMD K8 Socket
939 processors. Note, those heatsinks are recommended for maintaining the specified
Maximum T case requirement. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support AMD processors.
For vendor list of heatsink and fan, please visit:
http://www.amd.com/us-en/Processors/DevelopWithAMD/0,,30_2252_869_9460^9515,00.html
