9
CPU ZIF Socket 370
Lock
S
o
ck
et
3
7
0
Blank
Lever
White Dot
S
o
ck
et
3
7
0
CPU
2-7-3
Intel
®
Pentium
®
III Processor (256K) in the FC-PGA form factor: Mechanical Features
The FC-PGA package has the processor’s silicon die directly mounted to a pinned interposer substrate.
The pin grid array is partially populated and there may be surface mount components in the unpopulated
central area of the pin field.
Intel
®
Pentium
®
III Processor in the FC-PGA form factor: Mechanical Features
Reference Design: Heatsink
Substrate
Flip Chip Die
Pins
Fillet Epoxy
(Not to scale)
Flip-Chip Si Core
C4 Solder bumps
Surface mounted pins
Fillet Epoxy
(Not to scale)
Multi-layer substrate
FC-PGA with the reference
design heatsink
z
Intel’s reference design thermal solution is an
active heatsink; an extruded aluminum heatsink
base and a fan attached to the top on the fin
array.
•
Heatsinks for the PPGA will not work with the
FC-PGA. A pedestal is required on the
underside of the heatsink to clear the socket
cam box
z
Recommended thermal interface
material: Chomerics* XTS454.
