jbc PHS-1B, User Manual

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Profiles by Temperature
The usual way to run a profile is using the Thermocouple (TC) connected to the Control Input of the
console. JBC offers 3 predefined profiles (JBCset) and 10 profiles ready for you to personalize.
Why Infrared? The most efficient technology for PCB preheating
This is the most advanced, efficient and cost-effective method to preheat PCBs in any soldering job
or rework job. The low thermal mass of the infrared element gives outstanding control of the heat
output and the process temperature. This technology provides fast response, high heating rates and
uniform heating that ensure the best results.
Operation
JBCset profiles
There are 3 profiles predefined by JBC: A, B and C. The difference between them is the number
of steps: 2, 3 or 4. The thicker your PCB is and the more layers it contains, the more steps are
needed to obtain a gradual warming.
These profiles are not modifiable but they can be used as a template to create your own profiles.
JBCset A
2 steps
JBCset B
3 steps
JBCset C
4 steps
For repetitive jobs we recommend running profiles without the Thermocouple (TC). Once any
profile has been run to the end, the system has all the process data which you can save.
Once it is saved, you can run this profile without connecting the Thermocouple (TC). The heating
process will the same as long as the same working conditions are respected.
User profiles
You can create your own profiles from the JBCset profiles. On the work screen of the profile,
press the
Enter button and choose the option Edit profile.
Power Mode
The unit works at the selected power or temperature during the defined time. These parameters can
be modified from the work screen by pressing the
Enter
button and the
Edit parameters
menu
.
To see the current temperature you must plug the Thermocouple (TC) into the Control connector.
PCB reference
specifications:
FR4 1,6mm thick
and 2 layers.
FR4 2,2mm thick
and 6 layers.
FR4 1,6mm thick
and 6 layers.
Profiles set using the low position of the PHS-SA Support (28 mm in height between the PCB and the heating area).
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