jbc NP115, Instruction Manual, Page: 7 / 12

40 mm
50 mm
60 mm
80 mm
100 mm
130 mm 130 mm
para manuales - color gris
200 mm
300 mm
NAE
Control Unit
PORT
2
ROBOT
PEDAL
2
NAE
Control Unit
PORT
2
ROBOT
PEDAL
2
ROBOT
C115 C11
C105 /
C105 / C115
19:29 19:29
Port
2
Actual Temp. 25ºC
NT105
ºC
Power
45%
Selected 350ºC
350
Port
2
NT105
Hibernation
19:29
Port
2
Actual Temp. 25ºC
AN115
Hibernation
19:29
ºC
Power
45%
Selected 350ºC
350
Port
2
AN115
No
Yes
3
4
Pad Cleaning
Clean the pads with JBC´s desoldering tool
DS360.
For this operation JBC´s desoldering station
DSS is needed.
Solder Paste Dispensing
Apply the solder paste amount needed to
solder the new chip component.
The use of JBC´s DPM solder paste dispenser
is recommended.
DPM
Manual
Solder Paste
Dispenser
DS360
Micro
Desoldering Iron
Desoldering*
Lift the tweezers from the holder, press and
hold the pedal to activate the tweezers and
desolder the component.
Once the pedal is released the tweezers enters
in hibernation mode and cools down.
2
* “Press Mode” previously selected
5
6
Soldering
Once in position press and hold the pedal
to activate the tweezers and perform the
soldering.
Placing
Do not press the pedal.
Use the tweezers to position the component
on the previously tinned pad.
Note:
The inactive tool prevents the component from
heating up prematurely.
7