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verify that the Application Note or Technical Brief is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
AN1288.1
October 30, 2008
Application Note 1288
ISL8105BEVAL2Z Printed Circuit Board Layers
FIGURE 18. ISL8105BEVAL2Z - TOP LAYER (SILKSCREEN)
FIGURE 19. ISL8105BEVAL2Z - TOP LAYER
(COMPONENT SIDE)
FIGURE 20. ISL8105BEVAL2Z - LAYER 2
FIGURE 21. ISL8105BEVAL2Z - LAYER 3
FIGURE 22. ISL8105BEVAL2Z - BOTTOM LAYER
FIGURE 23. ISL8105BEVAL2Z - BOTTOM LAYER
(SOLDER SIDE)
