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4

AN1176.0

June 20, 2005

by clipping a test lead to the JP1 shunt, or if an external V

CC

 

supply is used it should be connected to the center pin of 
JP1 (shunt is removed). A ground connection is available at 
J3.

BACKUP SUPPLY

There are two sources of backup supply available. A 0.22µF 
supercapacitor (C10) is on the board. It will provide enough 
backup power for the typical RTC chip to last many days at 
room temperature when V

CC

 is set to 5V. There is also a 

CR2032 battery included in a socket to allow removal/ 
replacement without soldering. This battery will last up to ten 
years in normal backup operation. The backup supply is 
selectable via jumper JP2 as shown in Figure 3. One row of 
JP2 is connected to the device V

BACK

, and the other row to 

the power sources. There are three positions possible on 
JP2, Supercap, Battery, and Ground. If no backup is used 
the Ground position should be used. The jumper may be 
removed altogether and an alternative source for V

BACK

 can 

be attached to the board via the exposed header.

MICROCONTROLLER

The microcontroller used is the PIC16C63A. It has a 
dedicated serial interface which connects to the FDTI USB 
device. There is a dedicated I

2

C serial interface connected 

to the Intersil RTC device, EEPROM, and the temperature 
sensor. The power for the microcontroller comes from the 
USB 5V input, so the microcontroller will always be powered 
from 5V. Note that the RB1 to RB4 I/O pins for the 
microcontroller are available at the daughtercard connector, 

J3. This is to enable identification of the RTC daughtercard 
and thus enable functions for a particular device family. The 
device is socketed to allow removal or replacement for 
development activity and software upgrades with a newly-
programmed device.

DAUGHTERCARD CONNECTOR (J3)

This connector provides power and interface signals to the 
daughtercard containing the Intersil RTC device as follows:

Pin 1: V

CC

Pin 2: RB4

Pin 3: RB3

Pin 4: RB2

Pin 5: RB1

Pin 6: RB0 or Event Input

Pin 7: SDA

Pin 8: SCL

Pin 9: V

BAT

Pin 10: GND

This configuration allows these signals to control the Intersil 
device on an external board by connecting the serial 
interface and ground, available at the connector. Also 
available are the RB0 to RB4 I/O signals from the 
microcontroller (see Microcontroller section).

SUPERCAP

BACKUP

BATTERY

SOCKET

V

CC

 SELECT

DAUGHTERBOARD
CONNECTOR

SHUNT
FOR V

BACK

SELECT

FIGURE 3. RTC-USB MOTHERBOARD LAYOUT

Application Note 1176

Summary of Contents for ISL1208

Page 1: ...e is a decoupling capacitor on the daughtercard 0 1 F which must discharge fully before the RTC device stops operating This discharge time can be up to one second when using a VCC of 5V Note that when...

Page 2: ...creases During Polling the temperature of the daughtercard is displayed and updated once per second as well The ATR register is also displayed but will likely not change unless Temperature Compensatio...

Page 3: ...test the EVT bit If the EVT bit is set to 1 then the software will read and display the time of the event DISABLE EVENT MODE Disables the Event Mode Resets the EVEN EVENx and ESMPx bits to 0 and stops...

Page 4: ...ace which connects to the FDTI USB device There is a dedicated I2C serial interface connected to the Intersil RTC device EEPROM and the temperature sensor The power for the microcontroller comes from...

Page 5: ...d by adding a series ammeter to JP1 D1 provides visual indication of IRQ FOUT status and at low frequencies it will indicate that FOUT is enabled At higher FOUT frequencies it is possible to monitor t...

Page 6: ...n The event pin needs to be held to ground normally closed in order to detect an event Software and USB Troubleshooting Keep in mind that the RTC_USB board uses a serial to USB converter to communicat...

Page 7: ...unter resolution to get one PPM of accuracy 4 Test the ICC An ammeter can be connected in series with the JP1 terminals to monitor the VCC supply current to the device Note that when using the softwar...

Page 8: ...il the write is accepted by the device RTC Motherboard Bill of Materials DESIGNATOR PART TYPE FOOTPRINT DESCRIPTION MFR PART MFR PART NUMBER BT1 CR2032 Socket BATTX Battery and Socket MPD BS 3 ND Pana...

Page 9: ...6 R3 27 1206 R4 27 1206 R5 470 1206 R6 330 1206 470 R7 330 1206 Resistor R8 1 5K 1206 R9 2 2K 1206 Resistor U1 PIC16C63A SDIP28 PIC 16C63 8 bit CMOS Microcontroller Through Hole Socket 28 DIP x 0 3 Mi...

Page 10: ...XTL_206 Crystal Epson SE2406CT ND MC 206 32 768KA A2 U1 X1208 SO 8 RTC Intersil ISL1208S8I ISL1209 Bill of Materials DESIGNATOR PART TYPE FOOTPRINT DESCRIPTION MFR MFR PART NUMBER PART NUMBER C1 0 1 F...

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