www.irf.com
Page 11 of 13
IRAUDAMP17 REV
1.1
44
RHM10KARCT-ND
R52, R53, R56
RES 10K OHM 1/8W 5% 0805 SMD
3
Digikey
45
360-1758-ND S1
SWITCH TOGGLE SPDT .4VA SEAL
PCB
1 Digikey
46
DDZ5V1BDICT-ND
Z1, Z2
DIODE ZENER 5.1V 500MW SOD-123
2
Digikey
47
BZT52C11-FDICT-ND
Z3
DIODE ZENER 11V 500MW SOD123
1
Digikey
48
MMSZ5263BT1GOSCT-
ND
Z4
DIODE ZENER 56V 500MW SOD-123
1
Digikey
49
BZT52C36-FDICT-ND
Z5
DIODE ZENER 36V 500MW SOD-123
1
Digikey
50
8401K-ND
1/2" Standoffs 4-40
STDOFF HEX M/F 4-40 .500"L ALUM
4
Digikey
51
H724-ND
4-40 Nut
NUT HEX 4-40 STAINLESS STEEL
4
Digikey
52
H729-ND
No. 4 Lock Washer
WASHER LOCK INTERNAL #4 SS
4
Digikey
53
BER161-ND
Thermal Pad
THERMAL PAD .020" 4X4" GAPPAD
1/6
Digikey
IRAUDAMP17 Heatsink
Fig11
PCB Specifications
PCB:
1. Two Layers SMT PCB with through holes
2. 1/16 thickness
3. 2/0 OZ Cu
4. FR4 material
5. 10 mil lines and spaces
6. Solder Mask to be Green enamel EMP110 DBG (CARAPACE) or Enthone Endplate
DSR-3241or equivalent.
7. Silk Screen to be white epoxy non conductive per IPC–RB 276 Standard.
8. All exposed copper must finished with TIN-LEAD Sn 60 or 63 for 100u inches thick.
9. Tolerance of PCB size shall be 0.010 –0.000 inches
10. Tolerance of all Holes is -.000 + 0.003”
11. PCB acceptance criteria as defined for class II PCB’S standards.
