Intel Xeon Phi Processor x200, Thermal/Mechanical Specification And Design Manual

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Order Number: 334785-002 Intel
®
Xeon
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Phi™ Processor x200 Product Family TMSDG
111
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Mechanical KOZs
F Mechanical KOZs
F.1 Main Board Mechanical KOZs
Processor Heatsink Module (PHM) Keep-Out Zones are included in this appendix.
Table F-1 lists the mechanical drawings included in this appendix.
Table F-1. Mechanical Keep-Out Zone Drawing List
Description Figure
Processor Heatsink Module Topside Keep-Out Zone Figure F-1
Processor Heatsink Module Mounting Holes Keep-Out Zone Figure F-2
Processor Heatsink Module Backplate Keep-Out Zone Figure F-3