Intel® Xeon® Processor E5-2400 Product Family
33
Thermal/Mechanical Design Guide
Thermal Solutions
5
Thermal Solutions
This section describes a 1U reference heatsink and thermal design guidelines for the
Intel® Xeon® Processor E5-2400 Product Family.
5.1
Boundary Conditions
provides values for boundary conditions and performance targets used to
generate processor thermal specifications and to provide guidance for heatsink design.
provides approximate boundary conditions and approximate performance
expectations in Compact Electronics Bay. These values are not used to generate
processor thermal specifications, but may provide guidance for heatsink design.
Table 5-1.
Values Used to Generate Processor Thermal Specifications
Parameter
Value
Altitude, system
ambient temp
Sea level, 35
o
C
TDP
50W (4-
core)
60W
70W
80W (4-core)
95W
80W (2-core,
1 socket)
Ψ
CA
1
Notes:
1. Max target (mean + 3 sigma + offset) for thermal characterization parameter (
).
0.312
o
C/W
0.296
o
C/W
0.296
o
C/W
0.315
o
C/W
0.296
o
C/W
(8-core),
0.298
o
C/W
(6-core)
0.285
o
C/W
T
LA
2
2. Local ambient temperature of the air entering the heatsink.
49
o
C
48.1
o
C
Airflow
3
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
2
O.
9.7 CFM @ 0.23” dP
13 CFM @
0.28” dP
System height
(form factor)
1U (EEB)
4
4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).
Values above do not apply to LR-DIMM in an Intel Reference Design. Ducting is utilized to direct airflow.
1U
(non-specific,
1-socket)
Heatsink
volumetric
5
5. Dimensions of heatsink do not include socket or processor.
90 x 90 x 25.5 mm (1U/SSI blade)
6
6. Heatsink socket/processor height (
) complies with TEB 1U Rack Height Constraints
(36 mm) in EEB Specification 2011, and with Maximum Component Height (33.5 mm) in SSI Compute Blade
Specification, both at http://www.ssiforum.org.
Heatsink
technology
7
7. Passive heatsinks. PCM45F thermal interface material.
Cu base, Al fins
Table 5-2.
Performance Expectations in Compact Electronics Bay (CEB)
Parameter
Value
Altitude, system
ambient temp
Sea level, 35
o
C
TDP
50W
60W
70W
80W (4-core)
95W
T
LA
1
43.7
o
C
45.6
o
C
46.8
o
C
48.1
o
C
50.0
o
C (8-core),
46.6
o
C (6-core)
Summary of Contents for Xeon E5-2400
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Page 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
