Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor, Design Manual

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Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 54
Thermal Solutions
7
Thermal Solutions
This section describes 1U and ATCA reference heatsinks. These heatsink designs target
the Intel
®
Xeon
®
processor C5500/C3500 series and thermal design guidelines for the
processor.
7.1 Performance Targets
Table 7-1 provides boundary conditions and performance targets for 1U and ATCA
heatsinks. These values are used to generate processor thermal specifications and to
provide guidance for heatsink design. Other Intel
®
Xeon
®
Processor 5500 Series
thermal solutions may work with the same retention. See the Intel
®
Xeon
®
Processor
5500 Series Thermal/Mechanical Design Guide .
Note: Custom heatsinks and high airflow ATCA designs can cool higher power processors than
typical ATCA.
Note:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3
σ
) for thermal characterization parameter ( Section 7.5.1 ).
3. Reference system configuration. Processors are not limited to these form factors.
4. Local Ambient Temperature written 45/60
o
C means 45
o
C under Nominal conditions but 60
o
C is allowed for
Short-Term NEBS excursions.
5. Passive heatsinks with TIM.
Table 7-1. Boundary Conditions and Performance Targets
Parameter Value
Altitude, system
ambient temp
Sea level, 40
o
C
TDP 85 W 65 W 30 W 60 W 48 W 35 W
T
LA
1,4
52
o
C 55
o
C 55
o
C 52/67
o
C 52/67
o
C 45/60
o
C
Ψ
CA
2
0.303
o
C/W 0.302
o
C/W 0.313
o
C/W 0.302
o
C/W 0.532
o
C/W 0.970
o
C/W
System form
factor
3
1U 1U 1U 1U or ATCA ATCA ATCA or
Dense Blade
Heatsink
volumetric
90 x 90 x 27 mm (1U) 1U or Custom
ATCA
90 x 90 x 13
mm
90 x 90 x 13
mm
Heatsink
technology
5
Cu base, Al fins Cu base, Cu fins