Intel® Server Board S2600WF Product Family Technical Product Specification
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The PHM is properly installed when it is securely seated over the two bolster plate guide pins and sits evenly
over the processor socket as shown in Figure 16. Once the PHM is properly seated over the processor socket
assembly, the four heat sink Torx* screws must be tightened in the order specified on the label affixed to the
top side of the processor heat sink.
Caution: Failure to tighten the heat sink screws in the specified order may cause damage to the processor
socket assembly. Heat sink screws should be tightened to 12 in-lbs torque.
Note: For detailed processor assembly and installation instructions, refer to the appropriate Intel product
family
System Integration and Service Guide
.
To protect the pins within a processor socket from being damaged, server boards with no processor or heat
sink installed must have a plastic cover installed over each processor socket, as shown in Figure 17.
Processor socket covers must be removed before processor installation (Figure 17 – B).
Figure 17. Processor socket assembly and protective cover
3.2
Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel® processor-based systems, the processor must
remain within the defined minimum and maximum case temperature (T
CASE
) specifications. Thermal solutions
not designed to provide sufficient thermal capability may affect the long-term reliability of the processor and
system. The server board described in this document is designed to support the Intel® Xeon® processor
Scalable family TDP guidelines up to and including 205 W.
Disclaimer Note: Intel® server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis development and
testing that when Intel® server building blocks are used together, the fully integrated system meets the
intended thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel-developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for the specific application and environmental
conditions. Intel cannot be held responsible if components fail or the server board does not operate
correctly when used outside any of its published operating or non-operating limits.
