Intel® Server Board M50CYP2SB Family Technical Product Specification
34
3.
Processor Support
The server board includes two Socket-P4 LGA4189 processor sockets compatible with the 3
rd
Gen Intel®
Xeon® Scalable processor family. The server board supports the processor family with a maximum TDP of
270 W.
Note:
Previous generations Intel® Xeon® processor and Intel® Xeon® Scalable processor families and their
supported processor heat sinks are not compatible on server boards described in this document.
3.1
Processor Cooling Overview
The server board includes two processor socket assemblies, each consisting of a processor socket and
bolster plate. The factory installed bolster plate is secured to the server board. The bolster plate is generally
used to align the processor cooling hardware over the processor socket and secure it to the server board.
Processor cooling options in a server system may use a passive or active heat sink that use airflow to
dissipate heat generated by the processors. Other processor cooling options may use liquid cooling plates,
where cool liquid is pumped through the cooling plates to dissipate the heat from the processor.
For air-cooled systems, the processor and heat sink are generally pre-assembled into a single Processor
Heat-sink Module (PHM) before being installed onto the processor socket assembly. The PHM concept
reduces the risk of damaging pins within the processor socket during the processor installation process.
Note:
The Intel Server System M50CYP family only supports passive air-cooled options.
A PHM assembly consists of a processor, a processor carrier clip, and the processor heat sink. The following
figure identifies each component associated with the PHM and processor socket assembly.
Figure 18. PHM Components and Processor Socket Reference Diagram
